Abstract: Embodiments of this application provide a heat dissipation system and an electronic device. The heat dissipation system includes: a thermally conductive assembly that covers a surface of a heat source, where a thermally conductive medium is filled between the thermally conductive assembly and the heat source; a cooling fan that abuts against a part that is of the thermally conductive assembly and that is far away from the heat source, where an air outlet of the cooling fan faces the thermally conductive assembly; and a bridge, where a first end of the bridge is connected to a housing of the cooling fan, and a second end of the bridge laps over the thermally conductive assembly. Both the housing of the cooling fan and the bridge are made of metal materials.

Abstract: A housing and an electronic device. The housing includes a first support plate, a second support plate, and a vapor chamber. The first support plate, the vapor chamber, and the second support plate are laminated, and the vapor chamber is located between the first support plate and the second support plate, and is connected to the first support plate and the second support plate. Heat dissipation channels are disposed on the vapor chamber, the heat dissipation channels include a main heat dissipation channel and an auxiliary heat dissipation channel, the main heat dissipation channel and the auxiliary heat dissipation channel are connected, and heat exchange may occur between the main heat dissipation channel and the auxiliary heat dissipation channel. The housing may improve heat dissipation performance of the housing.

Abstract: A heat dissipating lid includes a first surface configured to be connected to the chip, and a groove located on the first surface. The first surface includes a first contact region. In a chip package structure, a boundary of an orthographic projection of the chip on the first surface coincides with a boundary of the first contact region. The groove is located outside the first contact region and connected to the first contact region, and the groove extends along at least a portion of the boundary of the first contact region. The heat dissipating lid is applicable to the chip package structure and configured to dissipate heat for the chip.

Abstract: The present disclosure relates to a method of decoding Low-Density Parity-Check (LDPC) codes in received data. The method comprises determining check nodes, variable nodes, and variable-to-check (VTC) messages based on the LDPC codes. Three or more minimum magnitude values of the determined VTC messages are then determined to obtain a determined minimum VTC message set. A set of check node messages from the determined minimum VTC message set is also determined, wherein the determined set of check node messages and the determined minimum VTC message set are used to determine a set of check-to-variable (CTV) messages. The present disclosure also relates to a corresponding method for encoding.

Abstract: This application provides a notebook computer. Specifically, the notebook computer includes a host, and the host includes a host housing, two first fans, and a second fan. The host housing includes a first wall plate and a second wall plate that are opposite to each other and that are spaced apart, and a third wall plate connected between the first wall plate and the second wall plate. A first air outlet structure is disposed on the second wall plate and/or the third wall plate. The two first fans are arranged at intervals, and an arrangement direction of the two first fans is parallel to the second wall plate. The second fan is disposed in the host housing, and is located between the foregoing two first fans. The second fan has an air outlet, and the air outlet of the second fan communicates with the first air outlet structure.

Abstract: A three-level prevention and control method for a rock burst roadway, the method comprising: pre-weakening a thick and hard rock layer above a roadway before the roadway is excavated; carrying out prestress support, pressure relief and reinforcement when the roadway is excavated; and carrying out stress transfer on an advance abutment pressure, and arranging a composite energy absorption protective structure around the roadway before the mining of a working face. By coordinating the spatio-temporal relationship between pressure relief, support and prevention, the energy dissipation in the rock burst roadway is changed from an unstable, disorderly and uncontrollable dissipation state to a stable, orderly and controllable dissipation state.

Abstract: The present invention provides use of a PDE4 inhibitor (e.g., compound of Formula (I)) or a pharmaceutically acceptable salt thereof in the manufacture of a medicament for reducing uric acid level, preventing an increased uric acid level in an individual, and treating, preventing, or alleviating a disease, disorder, or condition (for example, gout, hyperuricemia) associated with an increased uric acid level in an individual.

Abstract: The present disclosure relates to a method of decoding Low-Density Parity-Check (LDPC) codes in received data. The method comprises determining check nodes, variable nodes, and variable-to-check (VTC) messages based on the LDPC codes. Three or more minimum magnitude values of the determined VTC messages are then determined to obtain a determined minimum VTC message set. A set of check node messages from the determined minimum VTC message set is also determined, wherein the determined set of check node messages and the determined minimum VTC message set are used to determine a set of check-to-variable (CTV) messages. The present disclosure also relates to a corresponding method for encoding.

Abstract: This application provides a housing and an electronic device. The housing includes a first support plate, a second support plate, and a vapor chamber. The first support plate, the vapor chamber, and the second support plate are laminated, and the vapor chamber is located between the first support plate and the second support plate, and is connected to the first support plate and the second support plate. Heat dissipation channels are disposed on the vapor chamber, the heat dissipation channels include a main heat dissipation channel and an auxiliary heat dissipation channel, the main heat dissipation channel and the auxiliary heat dissipation channel are connected, and heat exchange may occur between the main heat dissipation channel and the auxiliary heat dissipation channel. The housing provided in this application is used to resolve a technical problem of poor heat dissipation performance of the housing in the conventional technology.

Abstract: The invention provides hydrophilic hot melt adhesive composition with improved water wetting properties. The hydrophilic hot melt adhesive is particularly suitable in the manufacture of disposable nonwoven articles.

Abstract: A three-level prevention and control method for a rock burst roadway, the method comprising: pre-weakening a thick and hard rock layer above a roadway before the roadway is excavated; carrying out prestress support, pressure relief and reinforcement when the roadway is excavated; and carrying out stress transfer on an advance abutment pressure, and arranging a composite energy absorption protective structure around the roadway before the mining of a working face. By coordinating the spatio-temporal relationship between pressure relief, support and prevention, the energy dissipation in the rock burst roadway is changed from an unstable, disorderly and uncontrollable dissipation state to a stable, orderly and controllable dissipation state.

Abstract: A method for preparing a probiotic preparation based on a W1/O/W2 double emulsion structure includes steps of: using a solution containing probiotics or a mixed solution of probiotics and a probiotic protective agent as an internal water phase W1; dissolving an emulsifier in a lipid phase O, and mixing the lipid phase O with the internal water phase W1; then preparing a primary emulsion W1/O by stirring and low-energy emulsification or high-energy emulsification; and using an emulsifier-contained solution as an external water phase W2, and adding the external water phase W2 to the primary emulsion W1/O; then preparing a W1/O/W2 double emulsion by stirring and the low-energy emulsification or the high-energy emulsification, thereby obtaining the probiotic preparation. The double emulsion system is used to embed the probiotics, which can keep the probiotics active during low-temperature storage and freezing and thawing.

Abstract: The present disclosure relates to a control scheme for a functional motor vehicle used in a fixed site. The present disclosure provides a motor vehicle control system, including a motor vehicle and a remote-controller. The motor vehicle is provided with at least one vehicle control button. The remote-controller is provided with at least one remote-controller control button. The remote-controller and the motor vehicle can conduct a positioning and ranging. The motor vehicle control system has a first control mode and a second control mode, that is, respectively, an automatic walking mode for ensuring the safety and an easy push mode for ensuring the safety. The present disclosure can improve the vehicle control modes, allowing users to obtain better customer experience.

Abstract: Absorbent articles, such as diapers or sanitary napkins, comprising a hydrophilic hot melt adhesive with water wetting properties. The hydrophilic hot melt adhesive comprises an ethylene copolymer selected from the group consisting of ethylene vinyl acetate, ethylene n-butyl acrylate, ethylene octene, ethylene propylene, ethylene butene propylene, and mixtures thereof and a nonionic, fatty alcohol ethoxylate surfactant. The hot melt adhesive is particularly suitable for bonding a nonwoven to another component of the article.

Abstract: The sprayable olefin-based hot melt adhesive and absorbent articles comprising the adhesive are disclosed. The sprayable olefin-based hot melt adhesive is particularly suitable for spraying at low application temperatures. The sprayable low application temperature hot melt adhesives have high green strength, excellent bond strength and aging performance. Moreover, the sprayable low application temperature hot melt adhesives allows for thin bond lines without bleed-through and burn-through risks for heat-sensitive substrates.

Abstract: Stretch laminate hot melt adhesives and stretch laminates are described. The stretch laminate hot melt adhesives are suitable for adhering elastic materials with inelastic substrates, and allow permanent deformation of the inelastic substrate and extensions and retractions of the elastic materials. The stretch laminate hot melt adhesive is particularly suitable for back ear lamination for disposable absorbent articles.