Abstract: Aspects of the present disclosure includes methods of forming a waveguide. The method of forming a waveguide includes depositing a mandrel disposed over a substrate. Portions of the mandrel are etched to form a trench. A spacer material is deposited over the mandrel and the substrate. The spacer material is etched to form a spacer in the trench. The mandrel is etched using ion beam etching (IBE). The mandrel and the substrate are etched to form a blazed grating. The spacer is removed.

Abstract: Embodiments of the present invention relate to waveguide and methods of forming waveguides. The waveguide includes a waveguide stack including a waveguide substrate having a top surface and a bottom surface, a first low index layer disposed on the top surface, a first cap layer disposed on the first low index layer, a first lens disposed on the first cap layer, and a first optically clear adhesive layer between the first low index layer and the first lens. In another embodiment, a method of forming a waveguide is provided. The method includes dispensing a liquid optically clear adhesive layer on a lens, placing a waveguide stack including a first low index layer onto the liquid optically clear adhesive opposite the lens, and curing the liquid optically clear adhesive. The waveguide stack further includes a first cap layer disposed on the first low index layer.

Abstract: Embodiments of the present disclosure generally relate methods of forming films for optical devices. A method of forming a film on an optical device includes disposing a film on a patterned substrate, directing ultraviolet (UV) light toward the patterned substrate to form a first portion of the film and a second portion of the film, and removing one of the first portion of the film or the second portion of the film. The patterned substrate includes a first grating and a second grating, the first grating and second grating formed from optical device structures. The film is disposed on at least one of the first grating or second grating.

Abstract: A method of processing an optical device is provided, including: positioning an optical device on a substrate support in an interior volume of a process chamber, the optical device including an optical device substrate and a plurality of optical device structures formed over the optical device substrate, each optical device structure including a bulk region formed of silicon carbide and one or more surface regions formed of silicon oxycarbide. The method further includes providing one or more process gases to the interior volume of the process chamber, and generating a plasma of the one or more process gases in the interior volume for a first time period when the optical device is on the substrate support, and stopping the plasma after the first time period. A carbon content of the one or more surface regions of each optical device structure is reduced by at least 50% by the plasma.

Abstract: Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to optical devices and methods of manufacturing a patterned optical device film on an optical device substrate. According to certain embodiments, an inkjet deposition process is used to deposit a patterned inkjet coating layer on the optical device substrate. A deposition process may then be used to deposit an optical device material on the patterned inkjet coating and the optical device substrate. The patterned inkjet coating on the optical device substrate may then be washed with an appropriate detergent to lift-off the patterned inkjet coating layer from the optical device substrate to form the patterned optical device film.

Abstract: Embodiments described herein relate to improved waveguides with materials layers improving the optical properties of one or more surface regions of waveguides and methods of forming the same. In one embodiment, a waveguide is provided. The waveguide including a substrate, a grating disposed in or on the substrate, the grating comprising a plurality of structures defined by a plurality of trenches, a layer of silicon oxide or aluminum oxide disposed over the structures on the substrate. The layer is disposed over sidewalls and top surfaces of the structures, and a bottom surface of the trenches. The waveguide further includes a high index layer disposed over the layer. The high index layer is disposed over the sidewalls and the top surfaces of the structures, and the bottom surface of the trenches with the layer disposed in between the structures and the high index layer.

Abstract: Embodiments of the present disclosure generally relate to optical devices. More specifically, embodiments described herein relate to optical devices and methods of manufacturing a patterned optical device film on an optical device substrate. According to certain embodiments, an inkjet deposition process is used to deposit a patterned inkjet coating layer on the optical device substrate. A deposition process may then be used to deposit an optical device material on the patterned inkjet coating and the optical device substrate. The patterned inkjet coating on the optical device substrate may then be washed with an appropriate detergent to lift-off the patterned inkjet coating layer from the optical device substrate to form the patterned optical device film.

Abstract: A method of processing an optical device is provided, including: positioning an optical device on a substrate support in an interior volume of a process chamber, the optical device including an optical device substrate and a plurality of optical device structures formed over the optical device substrate, each optical device structure including a bulk region formed of silicon carbide and one or more surface regions formed of silicon oxycarbide. The method further includes providing one or more process gases to the interior volume of the process chamber, and generating a plasma of the one or more process gases in the interior volume for a first time period when the optical device is on the substrate support, and stopping the plasma after the first time period. A carbon content of the one or more surface regions of each optical device structure is reduced by at least 50% by the plasma.