Abstract: A power management method include receiving, at a user interface, at least one input, generating at least one configuration characteristic based on the at least one input, and configuring a control circuit using the at least one configuration characteristic. The control circuit is associated with an inverter. The method also includes, in response to a determination that electrical power from a first electrical power input at an electrical panel is less than a threshold, using the control circuit, selectively controlling a state of at least one circuit of the electrical panel, and selectively directing power, received from a power storage mechanism and converted by the inverter, to the electrical panel, wherein the power storage mechanism receives electrical power from a second electrical power input.

Abstract: Etch bias is determined based on a curvature of a contour in a substrate pattern. The etch bias is configured to be used to enhance an accuracy of a semiconductor patterning process relative to prior patterning processes. In some embodiments, a representation of the substrate pattern is received, which includes the contour in the substrate pattern. The curvature of the contour of the substrate pattern is determined and inputted to a simulation model. The simulation model includes a correlation between etch biases and curvatures of contours. The etch bias for the contour in the substrate pattern is outputted by the simulation model based on the curvature.

Abstract: A method for selecting good quality images from raw images of a patterned substrate. The method includes obtaining a plurality of raw images (e.g., SEM images) of a patterned substrate; determining a raw image quality metric (e.g., an image score, an average slope, distance between contours) based on data associated with one or more gauges or one or more contours of one or more features within each image of the plurality of raw images, the raw image quality metric being indicative of a raw image quality; and selecting, based on the raw image quality metric, a sub-set of raw images from the plurality of raw images. The sub-set of raw images can be provided for performing more accurate measurements of the one or more features within an image.

Abstract: A method for generating modified contours and/or generating metrology gauges based on the modified contours. A method of generating metrology gauges for measuring a physical characteristic of a structure on a substrate includes obtaining (i) measured data associated with the physical characteristic of the structure printed on the substrate, and (ii) at least portion of a simulated contour of the structure, the at least a portion of the simulated contour being associated with the measured data; modifying, based on the measured data, the at least a portion of the simulated contour of the structure; and generating the metrology gauges on or adjacent to the modified at least a portion of the simulated contour, the metrology gauges being placed to measure the physical characteristic of the simulated contour of the structure.

Abstract: A method for accelerating calibration of a fabrication process model, the method including performing one or more iterations of: defining one or more fabrication process model terms; receiving predetermined information related to the one or more fabrication process model terms; generating a fabrication process model based on the predetermined information, the fabrication process model configured to generate one or more predictions related to a metrology gauge; determining whether a prediction related to a dimension of a gauge is within a predetermined threshold of the gauge as measured on a post-fabrication process substrate; and responsive to the prediction not breaching the predetermined threshold, optimizing the one or more fabrication process terms such that the prediction related to the dimension of the gauge is within the predetermined threshold of the gauge as measured on the post-fabrication process substrate.

Abstract: A method for accelerating calibration of a fabrication process model, the method including performing one or more iterations of: defining one or more fabrication process model terms; receiving predetermined information related to the one or more fabrication process model terms; generating a fabrication process model based on the predetermined information, the fabrication process model configured to generate one or more predictions related to a metrology gauge; determining whether a prediction related to a dimension of a gauge is within a predetermined threshold of the gauge as measured on a post-fabrication process substrate; and responsive to the prediction not breaching the predetermined threshold, optimizing the one or more fabrication process terms such that the prediction related to the dimension of the gauge is within the predetermined threshold of the gauge as measured on the post-fabrication process substrate.

Abstract: Disclosed are a diffractive optical element, a design method thereof and the application thereof in a solar cell. The design method for a design modulation thickness of a sampling point of the diffractive optical element comprises: calculating the modulation thickness of the current sampling point for each wavelength component; obtaining a series of alternative modulation thicknesses which are mutually equivalent for each modulation thickness, wherein a difference between the corresponding modulation phases is an integral multiple of 2?; and selecting one modulation thickness from the alternative modulation thicknesses of each wavelength to determine the design modulation thickness of the current sampling point. In an embodiment, the design method introduces a thickness optimization algorithm into a Yang-Gu algorithm.

Abstract: Disclosed are a diffractive optical element, a design method thereof and the application thereof in a solar cell. The design method for a design modulation thickness of a sampling point of the diffractive optical element comprises: calculating the modulation thickness of the current sampling point for each wavelength component; obtaining a series of alternative modulation thicknesses which are mutually equivalent for each modulation thickness, wherein a difference between the corresponding modulation phases is an integral multiple of 2?; and selecting one modulation thickness from the alternative modulation thicknesses of each wavelength to determine the design modulation thickness of the current sampling point. In an embodiment, the design method introduces a thickness optimization algorithm into a Yang-Gu algorithm.