Patents by Inventor Ji-Ping PENG

Ji-Ping PENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080308257
    Abstract: A heat dissipating assembly for dissipating heat of a heat source is provided. The heat dissipating assembly includes a body, at least one circulation pipe, and a working fluid. The body has a chamber defined therein and least one pipeline formed in a wall of the body. The body further has at least one first orifice in communication with the chamber of the body, and at least one second orifice in communication with the pipeline. The circulation pipe has two end portions respectively connected to the first orifice and the second orifice. The working fluid is accommodated in the chamber of the body, wherein the working fluid flows into the circulation pipe through the first orifice, and flows into the pipeline through the second orifice to flow back to the chamber of the body, thereby forming a two phase circulation loop.
    Type: Application
    Filed: June 12, 2007
    Publication date: December 18, 2008
    Applicant: Cooler Master Co., Ltd.
    Inventors: Ji-Ping Peng, Yi-Shen Chien
  • Publication number: 20080210404
    Abstract: A cooling device includes a heat-conducting base, two fin sets, and a heat pipe. The two fin sets are respectively constructed by a metallic stripe that is periodically folded and is arranged as a ring type. The heat pipe has a heated section that is thermally connected to the heat-conducting base, and a condensing section that is extended from the heat-conducting base is further formed as a flat shape, on which two oppositely flat faces are formed. The two flat faces of the condensing section of the heat pipe are respectively contacted closely with the two fin sets by being sandwiched therein. In such case, the contact area between the condensing section of heat pipe and the fin sets is enhanced, thus that the heat-conducting effect is promoted significantly.
    Type: Application
    Filed: January 3, 2008
    Publication date: September 4, 2008
    Inventor: Ji-Ping PENG