Abstract: A method for distributing an equity reward for federated learning based on an equity theory includes the following steps: applying Adams' equity theory to federated learning, analyzing, by a participant, all factors invested in a federated task comprehensively, then giving an expected reward for this task, calculating, by the task publisher, the reputation of the participant; participating, by the participant, in each round of a training task using a local data to evaluate data contribution, model contribution, and a waiting-time allowance of the participant, then combining contribution results of the three factors to evaluate the contribution of the participant; after a global model converges, dynamically adjusting weights of the three factors according to an objective function of the equity reward, with a goal that an actual reward of the participant is as close as possible to the expected reward, and obtaining and distributing the actual reward of the participant.

Abstract: Through the plasma spraying technology and the cold spraying high-speed deposition technology, an evenly distributed protective coating is formed on the surface of a plasma etching chamber. The protective coating, having a double-layer composite structure, includes a metal+Y2O3 coating as a metal+Y2O3 transition layer deposited by plasma spraying as a lower layer of the double-layer composite structure, and a high-purity Y2O3 ceramic coating coated on the metal+Y2O3 transition layer as an upper layer of the double-layer composite structure, the metal+Y2O3 transition layer is configured to reduce the difference in expansion coefficient between the Y2O3 ceramic coating and the metal substrate, and enhance the bonding force between the Y2O3 ceramic coating and the metal substrate; the high-purity Y2O3 ceramic coating is formed by depositing Y2O3 ceramic powders on the metal+Y2O3 transition layer at high speed through cold spraying high-speed deposition.

Abstract: Disclosed is an optical fiber flow velocity measuring apparatus and method integrating high and low ranges.

Abstract: Described are a two-dimensional wind-speed and wind-direction sensor and a system thereof, relating to the field of sensing devices. The two-dimensional wind-speed and wind-direction sensor includes: an X-direction wind speed probe assembly and a Y-direction wind speed probe assembly, the X-direction wind speed probe assembly and the Y-direction wind speed probe assembly are perpendicular to each other, and the X-direction wind speed probe assembly is configured to measure a X-direction wind speed including a wind speed in the reverse direction of an X-axis, Vx?, and a wind speed in the forward direction of the X-axis Vx+; and the Y-direction wind speed probe assembly is configured to measure a Y-direction wind speed including a wind speed in reverse direction of an Y-axis, Vy?, and a wind speed in the forward direction of the Y-axis, Vy+.

Abstract: Disclosed is an optical fiber flow velocity measuring apparatus and method integrating high and low ranges.

Abstract: A two-dimensional wind-speed and wind-direction sensor and a system thereof are provided, relating to the field of sensing devices, in order to alleviate the problem that the prior art fails to meet the user's demand for measuring two-dimensional wind speed and wind direction, and thus results in poor user experience, and to improve the user experience.

Abstract: A method for preparing a grounding substrate for a semiconductor device, the method including: 1) polishing the surface of a matrix of a grounding substrate to remove a carbon layer therefrom, and washing the surface of the matrix with anhydrous ethanol; 2) providing a cold spray system including a spraying device, a spray chamber, and a special fixture disposed in the spray chamber; and disposing the matrix on the special fixture; 3) using the cold spray system to spray a compressed gas carrying aluminum powder on the surface of the matrix at the supersonic speed to form an aluminum coating, thus obtaining the grounding substrate; 4) disposing the grounding substrate in a heat treatment furnace, raising the temperature therein to between 100 and 500° C., and maintaining the temperature for between 1 and 5 hrs; and 5) wet polishing the grounding substrate.