Patents by Inventor Jir-shyr Chen

Jir-shyr Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Using cell voltage as a monitor for deposition coverage
    Patent number: 7985328
    Abstract: A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage.
    Type: Grant
    Filed: February 4, 2008
    Date of Patent: July 26, 2011
    Assignee: Intel Corporation
    Inventors: Yang Cao, Yue Ma, Jir-shyr Chen, Rajiv Rastogi
  • Using cell voltage as a monitor for deposition coverage
    Publication number: 20080142363
    Abstract: A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage.
    Type: Application
    Filed: February 4, 2008
    Publication date: June 19, 2008
    Inventors: Yang Cao, Yue Ma, Jir-shyr Chen, Rajiv Rastogi
  • Using cell voltage as a monitor for deposition coverage
    Patent number: 7371312
    Abstract: A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage. In one embodiment, the voltage of a plating cell including a reference wafer which has substantially complete Cu seed coverage is measured. A reference resistance of the plating cell with the reference wafer is determined. The voltage of the plating cell including a calibration wafer which has no or insufficient seed coverage at its edge is measured. A calibration resistance of the plating cell with the calibration wafer is determined. An error trigger based on a comparison of the reference resistance with the calibration resistance is selected.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: May 13, 2008
    Assignee: Intel Corporation
    Inventors: Yang Cao, Yue Ma, Jir-shyr Chen, Rajiv Rastogi
  • Using cell voltage as a monitor for deposition coverage
    Publication number: 20050227381
    Abstract: A method and apparatus are described that use cell voltage and/or current as monitor to prevent electrochemical deposition (e.g., electroplating) tools from deplating wafers with no or poor metal (e.g., Cu) seed coverage.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 13, 2005
    Inventors: Yang Cao, Yue Ma, Jir-shyr Chen, Rajiv Rastogi