Patents by Inventor Jiri Crhonek

Jiri Crhonek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11692717
    Abstract: A hydronic floor heating system as it relates to an HVAC apparatus, approach and system. Aspects of the present system and approach may include a radiant floor optimization mode, low floor temperature in vacation mode, modifying a 300 Hz, or so, reading principle base on implementation of Pseudo-random jittering of a reading event improving short-term accuracy of the individual readings, and a combination of hardware and software filters for using thermal sensors with extended cable length.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: July 4, 2023
    Assignee: Ademco Inc.
    Inventors: Martin Adamek, Leos Mrazek, Jan Vomocil, Jiri Crhonek, Jan Vozenilek, Jiri Sapak, Oto Meran, Michal Sicner, Jaromir Cechak, Roman Cervinka, Daniel Becvar
  • Publication number: 20210172613
    Abstract: A hydronic floor heating system as it relates to an HVAC apparatus, approach and system. Aspects of the present system and approach may include a radiant floor optimization mode, low floor temperature in vacation mode, modifying a 300 Hz, or so, reading principle base on implementation of Pseudo-random jittering of a reading event improving short-term accuracy of the individual readings, and a combination of hardware and software filters for using thermal sensors with extended cable length.
    Type: Application
    Filed: February 17, 2021
    Publication date: June 10, 2021
    Inventors: Martin Adamek, Leos Mrazek, Jan Vomocil, Jiri Crhonek, Jan Vozenilek, Jiri Sapak, Oto Meran, Michal Sicner, Jaromir Cechak, Roman Cervinka, Daniel Becvar
  • Patent number: 10989419
    Abstract: A hydronic floor heating system as it relates to an HVAC apparatus, approach and system. Aspects of the present system and approach may include a radiant floor optimization mode, low floor temperature in vacation mode, modifying a 300 Hz, or so, reading principle base on implementation of Pseudo-random jittering of a reading event improving short-term accuracy of the individual readings, and a combination of hardware and software filters for using thermal sensors with extended cable length.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: April 27, 2021
    Assignee: Ademco Inc.
    Inventors: Martin Adamek, Leos Mrazek, Jan Vomocil, Jiri Crhonek, Jan Vozenilek, Jiri Sapak, Oto Meran, Michal Sicner, Jaromir Cechak, Roman Cervinka, Daniel Becvar
  • Publication number: 20190242592
    Abstract: A hydronic floor heating system as it relates to an HVAC apparatus, approach and system. Aspects of the present system and approach may include a radiant floor optimization mode, low floor temperature in vacation mode, modifying a 300 Hz, or so, reading principle base on implementation of Pseudo-random jittering of a reading event improving short-term accuracy of the individual readings, and a combination of hardware and software filters for using thermal sensors with extended cable length.
    Type: Application
    Filed: October 2, 2018
    Publication date: August 8, 2019
    Inventors: Martin Adamek, Leos Mrazek, Jan Vomocil, Jiri Crhonek, Jan Vozenilek, Jiri Sapak, Oto Meran, Michal Sicner, Jaromir Cechak, Roman Cervinka, Daniel Becvar
  • Patent number: 9752793
    Abstract: An HVAC Controller may include a first sub-assembly and a second sub-assembly capable of releasably engaging the first sub-assembly. The first sub-assembly may include a first housing and a printed circuit board having a controller for providing one or more control signals, where the printed circuit board may be secured relative to the first housing. The second sub-assembly may include a second housing, a power source, one or more output terminals, and a second printed circuit board. The second printed circuit board may be secured relative to the second housing and may have circuitry thereon that is powered by the power source and configured to receive the one or more control signals from the first printed circuit board. The circuitry of the second sub-assembly may set output terminals thereof to a predetermined state when the first sub-assembly is released from the second sub-assembly.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: September 5, 2017
    Assignee: Honeywell International Inc.
    Inventors: Josef Novotny, Jiri Sapak, Jiri Crhonek, Mohammad Aljabari, Eugene J. Takach
  • Publication number: 20140319236
    Abstract: An HVAC Controller may include a first sub-assembly and a second sub-assembly capable of releasably engaging the first sub-assembly. The first sub-assembly may include a first housing and a printed circuit board having a controller for providing one or more control signals, where the printed circuit board may be secured relative to the first housing. The second sub-assembly may include a second housing, a power source, one or more output terminals, and a second printed circuit board. The second printed circuit board may be secured relative to the second housing and may have circuitry thereon that is powered by the power source and configured to receive the one or more control signals from the first printed circuit board. The circuitry of the second sub-assembly may set output terminals thereof to a predetermined state when the first sub-assembly is released from the second sub-assembly.
    Type: Application
    Filed: May 1, 2014
    Publication date: October 30, 2014
    Inventors: Josef Novotny, Jiri Sapak, Jiri Crhonek, Mohammad Aljabari, Eugene J. Takach