Abstract: A device for one-sided etching of a semiconductor wafer (silicon wafer) is proposed, which consists in the manner of an etching box of a trough-shaped basic body (3, 23) and a lid (2, 22) which matches the latter hermetically. The lid (2, 22) has on the topside an opening (5, 25) for the passage of the etching liquid. The etching box bears at least two O-rings (7, 8, 27, 28), of which one is arranged centrally in the basic body (3, 23) and the other centrally in the lid (2, 22). The wafer (1) is clamped between the O-rings (7, 8, 27, 28). A wire (10) connected to the wafer by means of a plate of a spring contact (11, 41) is guided out of the etching box through a bore (4) extending through the basic body (3, 23).

Abstract: A rotation rate sensor has a multi-layer structure, with an oscillatory body (13) formed in one carrier layer (10). The body can be stimulated to oscillate in a first oscillation direction (1). On top of this body (13), a further structural element (21), which is deflectable normal to the major surface of the carrier (10) and which serves to detect Coriolis acceleration, is located. There is a device for capacitive or piezo-resistive measurement of the deflection of the structural element. Preferably, the entire structure is fabricated from a silicon wafer, so that the measurement device can be integrated onto the sensor element.

Abstract: A method is proposed for assembling micromechanical sensors, in particular Hall sensors, or pressure or acceleration sensors, in which at least one silicon sensor element is applied to a substrate. The at least one silicon sensor element is joined to the substrate via at least one assembly pedestal, the cap faces of which are kept small compared with the surface of the silicon sensor element, so that a gap exists between the substrate and the silicon sensor element except for the region of the at least one assembly pedestal.

Abstract: A fuel injection valve including a perforated silicon plate disposed downstream of a valve seat and having an atomization opening that widens in the flow direction. The perforated silicon plate has at least one elongated recess on an upper end face oriented toward the valve seat face; this recess at least partly overlaps a metering opening extending as far as a lower face end of the perforated plate. The perforated plate makes it possible to form flat streams, so that very fine atomization of the injected fuel is attained. Forming the elongated recesses and atomization openings by etching makes high-precision manufacture possible at low production cost. The perforated plate and fuel injection valve are especially suitable for injection systems of mixture-compressing internal combustion engines with externally supplied ignition.

Abstract: From a silicon block or wafer a stationary frame is shaped and a seismic mass which is displaceable in rotation is mounted within the frame. The seismic mass is symmetrically suspended in the frame by two pairs of oppositely located flexible strips and either piezoresistive or capacitive detection of rotation is provided by the strips, the capacitive detection beeing provided with the help of parallel stationary electrodes connected to and insulated in the frame. In another embodiment an anchor stud in the center of the frame has two flexible interlaced spirals extending therefrom and their respective outer turns carry radial disposed masses with finger structures extending circumferentially in both directions. Stationary finger structures are provided to provide interfitting variable capacitors sensitive to rotary displacements.

Abstract: A microwave is made of a stack of layers. A sculptured silicon substrate is held between two covers each consisting of one or more layers. The inlet and the outlet of the microvalve are formed by perforations in the respective covers. A central valve plate is sculptured out of the silicon substrate with surfaces respectively facing the two covers in the region of the inlet and outlet in a symmetrical fashion. The valve plate is connected to the outer frame portion of the silicon substrate by one or more silicon strips. The valve plate is also shaped as a closure member near the inlet and/or the outlet. Electrodes are provided on the covers opposite the valve plate so that the valve can be electrostatically actuated with the valve plate serving as counterelectrode for these electrodes on the covers.

Abstract: A semiconductor plate having an epitaxial layer of a conductivity type opposite to that of the substrate on which it is formed has a depression, including one or more elongate channels. The depression is etched into a depth passing entirely through the epitaxial layer to isolate at least one tongue extending from a tongue pedestal into the etched depression and having parallel major sides which are perpendicular to the principal planes of the semiconductor plate. The tongue is under-etched so that it will be free to vibrate by motion in directions parallel to the principal planes of the plate. One of the major sides of the tongue faces a stationary electrode across a gap and the electrode and the tongue are insulated from each other, at least in one embodiment, by the fact that the etched depression extends all the way through the epitaxial layer in its depth.

Abstract: In an acceleration pick-up (11), the bending spring (13) is a substrate plate, e.g. produced from Al.sub.2 O.sub.3, which is arranged at one side on an elevated portion (12) of a support (10) produced from mechanically rigid material. Accordingly, the resistors (19 to 22) and particularly the evaluating circuit (24) on an elevated portion (12) of the support (10) can be arranged jointly on the bending spring (13) and applied in a single work step using thick-film technology. In addition, a cut out portion (14) is formed in the bending spring (13), so that two bending webs (15, 16) can be formed at the greatest possible distance from one another. Two of the resistors (19, 21) are arranged on the bending webs (15, 16) and one of the remaining resistors (20, 22) is arranged in the area of the cut out portion (14). Accordingly, an electrical monitoring of the mechanical state of the bending spring (13) is made possible.

Abstract: A sensor for acceleration measurement, for example for automatic release of occupant protective devices in vehicles, especially power vehicles, in which during deceleration of the vehicle or vehicle part a control signal is produced. The sensor comprises a support, a pendulum with a seismic mass mounted on two bending bars formed in the support, resistances each provided on a respective one of the bending bars, and further resistances each arranged on the support in the region between the bending bars and on the pendulum in the region between the bending bars, the first mentioned resistances and the further resistances being connected in a Wheatstone bridge.

Abstract: The capacitive proximity sensor for motor vehicles comprises a capacitance-measuring device for measuring the capacitance between at least one capacitor plate (1) which is fixed to the motor vehicle, on the one hand, and the environment, on the other hand, and an indicator for receiving the output signal of the measuring device.To provide a proximity sensor in which the disturbing and parasitary capacitances occurring in practice are particularly taken into account, the output signal S.sub.c of the capacitance-measuring device (5) is delivered to an amplifier (6), which is provided with a degenerative feedback loop (9) comprising a storage device (11) and a switch (10) so that the output signal (s.sub.A) of the amplifier (6) is held constant during normal travel, and the switch (10) is opened to interrupt the degenerative feedback loop (9) for a measurement. The switch is closed when the measurement has been completed.