Abstract: There is provided a grinding apparatus including a chuck table configured to hold a workpiece, a grinding unit configured to grind the workpiece held by the chuck table by grinding stones fixed to a grinding wheel, a grinding feed mechanism configured to raise or lower the grinding unit, a reading unit configured to read a thickness of a base which thickness is recorded on a recording medium on which the thickness of the base of the grinding wheel is recorded, a base thickness storage section configured to store the thickness of the base which thickness is read by the reading unit, and a detecting unit configured to make the grinding unit perform processing by the grinding feed mechanism, and detect a fitting surface of a mount and the lower surface of a grinding stone of the grinding wheel fitted to the mount.

Abstract: A grinding apparatus includes a grinding unit, a grinding feeding mechanism, and a grinding water supply unit. The grinding water supply unit includes a nozzle that jets grinding water to grindstones, and a biasing mechanism that biases the nozzle upward. The nozzle is configured to be movable downward against the upward biasing according to a downward movement of the grinding unit. The grinding apparatus further includes an upper limit stopping section that sets an upper limit position for upward movement of the nozzle biased upward by the biasing mechanism, for forming a gap through which the grinding wheel is passed, between the nozzle and the mount.

Abstract: A grinding apparatus has a grinding wheel fastened to a mount disk connected a spindle by a plurality of bolts. The mount disk has at least three threaded holes and a plurality of protrusions protruding from a mount surface thereof. Each of the bolts includes an externally threaded shank, a neck coupled to the externally threaded shank, and an engaging flange coupled to the neck and extending radially outwardly. The grinding wheel includes an annular open hole defined in a mating surface of an annular base for mating with the mount surface, an annular slot that is wider than the annular open hole and is fluidly connected to the annular open hole, at least three insertion holes in the annular open hole for allowing the engaging flange to be inserted into the annular slot, and a plurality of protrusion insertion holes for receiving the engaging flanges of the bolts.

Abstract: A grinding apparatus includes a chuck table that holds a wafer on a holding surface; a grinding unit that has a spindle unit in which a spindle with an annular grindstone mounted to a tip thereof is rotatably supported and that grinds the wafer by use of the grindstone; a grinding feeding mechanism that puts the grinding unit into grinding feeding in a grinding feeding direction perpendicular to the holding surface; a first height gauge that measures the height of the holding surface; a second height gauge that measures the height of an upper surface of the wafer; and a calculation section that calculates the difference between the height of the holding surface and the height of the upper surface of the wafer, as the thickness of the wafer. In the grinding apparatus, the first height gauge and the second height gauge are disposed in the grinding unit.

Abstract: There is provided a grinding apparatus including a chuck table configured to hold a workpiece, a grinding unit configured to grind the workpiece held by the chuck table by grinding stones fixed to a grinding wheel, a grinding feed mechanism configured to raise or lower the grinding unit, a reading unit configured to read a thickness of a base which thickness is recorded on a recording medium on which the thickness of the base of the grinding wheel is recorded, a base thickness storage section configured to store the thickness of the base which thickness is read by the reading unit, and a detecting unit configured to make the grinding unit perform processing by the grinding feed mechanism, and detect a fitting surface of a mount and the lower surface of a grinding stone of the grinding wheel fitted to the mount.

Abstract: A height of an upper surface of a sub-chuck table is measured by a holding surface measuring unit in contact with the upper surface of the sub-chuck table. A height of a holding surface of a chuck table is measured by an upper surface height measuring unit in contact with the holding surface of the chuck table. A first difference between the height of the upper surface of the sub-chuck table and the height of the holding surface of the chuck table is calculated. A workpiece is held on the holding surface, and the height of the upper surface of the sub-chuck table is calculated again by the holding surface measuring unit. The upper surface height measuring unit is brought into contact with the upper surface of the workpiece by vertically moving it, and the height of the upper surface of the workpiece is measured.

Abstract: A grinding apparatus includes a chuck table that holds a wafer on a holding surface; a grinding unit that has a spindle unit in which a spindle with an annular grindstone mounted to a tip thereof is rotatably supported and that grinds the wafer by use of the grindstone; a grinding feeding mechanism that puts the grinding unit into grinding feeding in a grinding feeding direction perpendicular to the holding surface; a first height gauge that measures the height of the holding surface; a second height gauge that measures the height of an upper surface of the wafer; and a calculation section that calculates the difference between the height of the holding surface and the height of the upper surface of the wafer, as the thickness of the wafer. In the grinding apparatus, the first height gauge and the second height gauge are disposed in the grinding unit.

Abstract: Disclosed herein is a processing machine including a processing unit and a workpiece holding unit. The processing unit has a processor wheel with a processor fixed on a lower surface of an annular base, and a mount fixed on a spindle, and processes a workpiece by the processor with the processor wheel mounted on the mount. The processor wheel has a plurality of flange portions arranged at equal angular intervals on an inner peripheral surface of the annular base and extending from the inner peripheral surface toward a center of the processor wheel. The mount has a plurality of clasp portions configured to clasp the flange portions, a plurality of springs biasing the clasp portions in an upward direction in an axial direction of the spindle, and a plurality of support portions configured to support the clasp portions movably in the axial direction.

Abstract: A grinding apparatus includes a grinding unit, a grinding feeding mechanism, and a grinding water supply unit. The grinding water supply unit includes a nozzle that jets grinding water to grindstones, and a biasing mechanism that biases the nozzle upward. The nozzle is configured to be movable downward against the upward biasing according to a downward movement of the grinding unit. The grinding apparatus further includes an upper limit stopping section that sets an upper limit position for upward movement of the nozzle biased upward by the biasing mechanism, for forming a gap through which the grinding wheel is passed, between the nozzle and the mount.

Abstract: A height of an upper surface of a sub-chuck table is measured by a holding surface measuring unit in contact with the upper surface of the sub-chuck table. A height of a holding surface of a chuck table is measured by an upper surface height measuring unit in contact with the holding surface of the chuck table, A first difference between the height of the upper surface of the sub-chuck table and the height of the holding surface of the chuck table is calculated. A workpiece is held on the holding surface, and the height of the upper surface of the sub-chuck table is calculated again by the holding surface measuring unit. The upper surface height measuring unit is brought into contact with the upper surface of the workpiece by vertically moving it, and the height of the upper surface of the workpiece is measured.

Abstract: An apparatus for polishing an optical disk according to the present invention includes a flange 24 holding a polishing body 20 such as sandpaper, a backup member 21 interposed between the polishing body 20 and the flange 24, a rotation table 12 holding an optical disk 10 as a polished body, a pressing unit 28 for pressing the polishing body 20 against the optical disk 10 with a predetermined contact pressure required for polishing and motors 26 and 14 for rotationally driving the flange 24 and the rotation table 12 respectively. The backup member 21 is deformable within the range of 0.05 to 0.3 mm when pressed with the predetermined contact pressure, which makes it possible to substantially equalize the contact pressure of the polishing body 20 against the optical disk 10 on the entire polishing surface and to prevent the occurrence of roundness on the periphery of the optical disk.

Abstract: The present invention relates to a polishing apparatus for restoring an optical disk. The objects of the present invention are as follows: to obtain an equal pressure appropriately required for polishing; to correct the accuracy of parallelism between the rotation planes of an optical disk and a polishing sheet; to remove roundness formed on the outer edge of an optical disk and unevenness in polishing; and to prevent clogging of the surface of a polishing sheet by the active elimination of abrasive filings and an occurrence of scratches on the surface of an optical disk due to the clogging. For the purpose of achieving the above objects, in an apparatus for polishing an optical disk composed of a disk rotator A and a polishing mechanism B, the polishing mechanism B has an elastic mechanism D for elastically holding a polishing pad C, a polishing sheet of the polishing pad C has such an elasticity that the deformation amount ?x is 0.005 mm to 0.