Patents by Inventor Jiro Higashijima
Jiro Higashijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240124984Abstract: A substrate processing apparatus that supplies a processing liquid to a front surface of a substrate which is rotating, includes: a substrate holder configured to hold the substrate, wherein the substrate holder includes: a gripper configured to come into contact with a periphery of the substrate to grip the substrate; and a base to which the gripper is attached.Type: ApplicationFiled: October 10, 2023Publication date: April 18, 2024Inventors: Yusuke HASHIMOTO, Daisuke GOTO, Nobuhiro OGATA, Jiro HIGASHIJIMA, Tomoaki OBARU, Kanta MORI
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Patent number: 11715650Abstract: A substrate processing apparatus includes a nozzle unit. The nozzle unit includes a line and a nozzle tip provided on a tip end of the line. The line includes a first layer, a second layer and a third layer. The nozzle tip is formed of a corrosion resistant resin having conductivity. The third layer is configured to cover the first layer and the second layer from outside and cover a part of the nozzle tip from outside.Type: GrantFiled: August 4, 2020Date of Patent: August 1, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Yusuke Hashimoto, Jiro Higashijima
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Patent number: 11574827Abstract: A substrate processing apparatus includes: a processing unit including a holder that holds a substrate and rotates the substrate, a nozzle that ejects a processing liquid, and a conductive piping unit that supplies the processing liquid to the nozzle; a controller that causes the processing unit to execute a liquid processing in which the substrate is processed by supplying the processing liquid from the nozzle to the substrate that is held and rotated by the holder, and a measuring unit that measures a flowing current generated by the processing liquid flowing through the piping unit. The controller monitors the liquid processing based on a measurement result by the measuring unit.Type: GrantFiled: August 17, 2018Date of Patent: February 7, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Tadashi Iino, Yoshihiro Kai, Yoichi Tokunaga, Nobuhiro Ogata, Jiro Higashijima
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Publication number: 20230001458Abstract: A substrate processing apparatus includes a holder configured to hold a substrate; a driving unit configured to rotate the holder; an inner cup body provided in the holder to surround the substrate held by the holder; a mist guard, surrounding the holder and the inner cup body, configured to be moved up and down; a cleaning liquid supply configured to supply a cleaning liquid; and a controller. The controller is configured to perform: supplying a processing liquid to the substrate from a processing liquid supply, in a state that the substrate is held by the holder and the mist guard is raised; and dispersing, after the supplying of the processing liquid, the cleaning liquid supplied from the cleaning liquid supply to an entire inner peripheral surface of the mist guard, in a state that the substrate is carried out from the holder and the mist guard is raised.Type: ApplicationFiled: July 1, 2022Publication date: January 5, 2023Inventors: Yusuke Hashimoto, Daisuke Goto, Kanta Mori, Jiro Higashijima, Nobuhiro Ogata
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Patent number: 11430673Abstract: A substrate processing apparatus includes at least one nozzle unit configured to eject a processing liquid to a substrate. The at least one nozzle unit includes a conductive part for voltage application configured to be brought into contact with the processing liquid, and a voltage detection part or a current detection part configured to be brought into contact with the processing liquid. A non-conductive part is interposed between the conductive part for voltage application and the voltage detection part or between the conductive part for voltage application and the current detection part. A voltage application part is connected to the conductive part for voltage application, and a voltage detector is installed in the voltage detection part or a current detector is installed in the current detection part.Type: GrantFiled: April 14, 2021Date of Patent: August 30, 2022Assignee: Tokyo Electron LimitedInventors: Yusuke Hashimoto, Jiro Higashijima
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Patent number: 11158525Abstract: A recovery route returns, to a retaining tank, mixed solution supplied to a substrate processing unit. A discarding route discards the supplied mixed solution to a place other than the retaining tank. A switching controller causes the supplied mixed solution to flow into the discarding route during a time interval until a first time interval has elapsed from a time point when the substrate processing unit starts to supply the mixed solution; causes the supplied mixed solution to flow into the recovery route during a time interval until a second time interval, which is decided based on a predetermined recovery rate, has elapsed after the first time interval elapses; and causes the supplied mixed solution to flow into the discarding route during a time interval until supply of the mixed solution has been ended from a time point when the second time interval elapses.Type: GrantFiled: January 20, 2017Date of Patent: October 26, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Yasuhiro Takaki, Shinichi Umeno, Takashi Nagai, Hisashi Morita, Nobuhiro Ogata, Yusuke Takamatsu, Jiro Higashijima
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Publication number: 20210327728Abstract: A substrate processing apparatus includes at least one nozzle unit configured to eject a processing liquid to a substrate. The at least one nozzle unit includes a conductive part for voltage application configured to be brought into contact with the processing liquid, and a voltage detection part or a current detection part configured to be brought into contact with the processing liquid. A non-conductive part is interposed between the conductive part for voltage application and the voltage detection part or between the conductive part for voltage application and the current detection part. A voltage application part is connected to the conductive part for voltage application, and a voltage detector is installed in the voltage detection part or a current detector is installed in the current detection part.Type: ApplicationFiled: April 14, 2021Publication date: October 21, 2021Inventors: Yusuke HASHIMOTO, Jiro HIGASHIJIMA
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Patent number: 11056335Abstract: A substrate processing apparatus includes a processing liquid supply mechanism 70 configured to supply a SPM liquid to a substrate; a temperature adjusting unit (heater) 303 configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism 70; an acquisition unit (temperature sensor) 80 configured to acquire temperature information of the SPM liquid on a surface of the substrate; and a control unit 18 configured to set an adjustment amount of the temperature adjusting unit (heater) 303 based on the temperature information of the SPM liquid acquired by the acquisition unit (temperature sensor) 80. The temperature adjusting unit (heater) 303 adjusts, based on the adjustment amount set by the control unit 18, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate.Type: GrantFiled: December 11, 2019Date of Patent: July 6, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Jiro Higashijima, Nobuhiro Ogata, Yusuke Hashimoto
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Patent number: 11024518Abstract: A substrate processing apparatus includes a stationary cup body 51 provided to surround a substrate holding unit 31 and configured to receive a processing liquid or mist of the processing liquid discharged onto a substrate, the stationary cup body not being moved relatively with respect to a processing vessel; a mist guard 80; and a guard elevating mechanism 84 configured to elevate the mist guard. Here, the mist guard is provided at an outside of the stationary cup body to surround the stationary cup body and configured to block a liquid scattered outwards beyond a space above the stationary cup body. Further, the mist guard includes a cylindrical portion 81 of a cylindrical shape and a protruding portion 82 protruded from an upper portion of the cylindrical portion toward an inside of the cylindrical portion.Type: GrantFiled: July 28, 2016Date of Patent: June 1, 2021Assignee: TOKYO ELECTRON LIMITEDInventors: Norihiro Ito, Jiro Higashijima, Nobuhiro Ogata, Takahisa Otsuka, Yuichi Douki, Yusuke Hashimoto, Kazuhiro Aiura, Daisuke Goto
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Publication number: 20210043467Abstract: A substrate processing apparatus includes a nozzle unit. The nozzle unit includes a line and a nozzle tip provided on a tip end of the line. The line includes a first layer, a second layer and a third layer. The nozzle tip is formed of a corrosion resistant resin having conductivity. The third layer is configured to cover the first layer and the second layer from outside and cover a part of the nozzle tip from outside.Type: ApplicationFiled: August 4, 2020Publication date: February 11, 2021Inventors: Yusuke Hashimoto, Jiro Higashijima
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Publication number: 20200357667Abstract: A substrate processing apparatus includes: a processing unit including a holder that holds a substrate and rotates the substrate, a nozzle that ejects a processing liquid, and a conductive piping unit that supplies the processing liquid to the nozzle; a controller that causes the processing unit to execute a liquid processing in which the substrate is processed by supplying the processing liquid from the nozzle to the substrate that is held and rotated by the holder, and a measuring unit that measures a flowing current generated by the processing liquid flowing through the piping unit. The controller monitors the liquid processing based on a measurement result by the measuring unit.Type: ApplicationFiled: August 17, 2018Publication date: November 12, 2020Inventors: Tadashi IINO, Yoshihiro Kai, Yoichi Tokunaga, Nobuhiro Ogata, Jiro Higashijima
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Publication number: 20200152443Abstract: A substrate processing apparatus includes a processing liquid supply mechanism 70 configured to supply a SPM liquid to a substrate; a temperature adjusting unit (heater) 303 configured to adjust a temperature of the SPM liquid at a time when the SPM liquid is supplied to the substrate from the processing liquid supply mechanism 70; an acquisition unit (temperature sensor) 80 configured to acquire temperature information of the SPM liquid on a surface of the substrate; and a control unit 18 configured to set an adjustment amount of the temperature adjusting unit (heater) 303 based on the temperature information of the SPM liquid acquired by the acquisition unit (temperature sensor) 80. The temperature adjusting unit (heater) 303 adjusts, based on the adjustment amount set by the control unit 18, the temperature of the SPM liquid at the time when the SPM liquid is supplied to the substrate.Type: ApplicationFiled: December 11, 2019Publication date: May 14, 2020Inventors: Jiro Higashijima, Nobuhiro Ogata, Yusuke Hashimoto
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Patent number: 10486208Abstract: According to the present disclosure, both first and second cup bodies are brought into a state of being close to each other by lifting one of the first and second cup bodies. A first gap between a gap forming portion formed on the lower surface of a first protruding portion and the upper surface of a second protruding portion is narrower than a second gap between a portion of the first protruding portion where the gap forming portion is absent, and the upper surface of the second protruding portion. In this state, a cleaning liquid is supplied to the second gap. Since movement of the cleaning liquid that tends to flow radially outward is restricted by the first narrow gap, the entire area between the first and second protruding portions may be filled with the cleaning liquid so that the surface to be cleaned may be evenly cleaned.Type: GrantFiled: June 16, 2017Date of Patent: November 26, 2019Assignee: Tokyo Electron LimitedInventors: Nobuhiro Ogata, Norihiro Ito, Jiro Higashijima, Yusuke Hashimoto, Kazuhiro Aiura
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Patent number: 10475671Abstract: Disclosed is a substrate processing apparatus including: a holding unit configured to hold a substrate; a processing liquid supply unit configured to supply a first processing liquid and a second processing liquid to the substrate; a first cup configured to recover the first processing liquid; a second cup disposed adjacent to the first cup and configured to recover the second processing liquid; a recovery portion defined by a peripheral wall portion that is erected on a bottom portion of the first cup; and a cleaning liquid supply unit configured to supply a cleaning liquid to the recovery portion. The peripheral wall portion is cleaned by causing the cleaning liquid supplied by the cleaning liquid supply unit to overflow from the peripheral wall portion to the second cup side.Type: GrantFiled: December 27, 2016Date of Patent: November 12, 2019Assignee: Tokyo Electron LimitedInventors: Jiro Higashijima, Nobuhiro Ogata, Yusuke Hashimoto
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Patent number: 10297473Abstract: A liquid processing apparatus performs a liquid processing on a rotating substrate by supplying a processing liquid. Surrounding members surround a region including an upper space of a cup body surrounding the rotating substrate and provided with an opening above the substrate. An air flow forming portion forms a descending air flow from an upper side of the cup body. A bottom surface portion blocks between the cup body and the surrounding member along a circumferential direction. An exhaust port is provided above the bottom surface portion and outside the cup body to exhaust an atmosphere in a region surrounded by the surrounding members and the bottom surface portion.Type: GrantFiled: August 21, 2017Date of Patent: May 21, 2019Assignee: Tokyo Electron LimitedInventors: Terufumi Wakiyama, Norihiro Ito, Jiro Higashijima
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Patent number: 10276425Abstract: A substrate processing system includes: a holding plate provided to be rotatable around a vertical axis; a substrate holding member provided on the holding plate to hold a substrate; a rotary drive unit that rotates the substrate in a predetermined direction; and a processing fluid supply unit that supplies a processing liquid to the substrate. The substrate holding member includes a first side portion provided at a position facing the substrate and a second side portion and a third side portion that are adjacent to the first side portion. The first side portion includes a gripping portion configured to grip an end surface of the substrate. The second side portion forms a pointed end portion with the first side portion, and includes a liquid flow guide portion that guides the processing liquid to a lower side of the substrate after the processing liquid is supplied to the substrate.Type: GrantFiled: November 17, 2015Date of Patent: April 30, 2019Assignee: Tokyo Electron LimitedInventors: Terufumi Wakiyama, Norihiro Ito, Jiro Higashijima, Satoshi Biwa
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Publication number: 20190067048Abstract: A recovery route returns, to a retaining tank, mixed solution supplied to a substrate processing unit. A discarding route discards the supplied mixed solution to a place other than the retaining tank. A switching controller causes the supplied mixed solution to flow into the discarding route during a time interval until a first time interval has elapsed from a time point when the substrate processing unit starts to supply the mixed solution; causes the supplied mixed solution to flow into the recovery route during a time interval until a second time interval, which is decided based on a predetermined recovery rate, has elapsed after the first time interval elapses; and causes the supplied mixed solution to flow into the discarding route during a time interval until supply of the mixed solution has been ended from a time point when the second time interval elapses.Type: ApplicationFiled: January 20, 2017Publication date: February 28, 2019Applicant: TOKYO ELECTRON LIMITEDInventors: Yasuhiro Takaki, Shinichi Umeno, Takashi Nagai, Hisashi Morita, Nobuhiro Ogata, Yusuke Takamatsu, Jiro Higashijima
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Publication number: 20180221925Abstract: A substrate processing apparatus includes a stationary cup body 51 provided to surround a substrate holding unit 31 and configured to receive a processing liquid or mist of the processing liquid discharged onto a substrate, the stationary cup body not being moved relatively with respect to a processing vessel; a mist guard 80; and a guard elevating mechanism 84 configured to elevate the mist guard. Here, the mist guard is provided at an outside of the stationary cup body to surround the stationary cup body and configured to block a liquid scattered outwards beyond a space above the stationary cup body. Further, the mist guard includes a cylindrical portion 81 of a cylindrical shape and a protruding portion 82 protruded from an upper portion of the cylindrical portion toward an inside of the cylindrical portion.Type: ApplicationFiled: July 28, 2016Publication date: August 9, 2018Inventors: Norihiro Ito, Jiro Higashijima, Nobuhiro Ogata, Takahisa Otsuka, Yuichi Douki, Yusuke Hashimoto, Kazuhiro Aiura, Daisuke Goto
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Patent number: 9953852Abstract: A liquid processing apparatus of the present disclosure performs a liquid processing by supplying a processing liquid to a substrate that is rotating. A substrate holding unit configured to be rotatable around a vertical axis is provided with a holding surface to attract and hold a bottom surface of the substrate horizontally. A guide unit is formed integrally with the substrate holding unit, disposed around the substrate held in the substrate holding unit, and provided at a position equal to or lower than a height of a top surface of a periphery of the substrate. The guide unit includes a guide surface configured to guide the processing liquid. A rotary cup rotates integrally with the substrate holding unit, and guides the processing liquid towards the cup between the rotary cup and the guide unit.Type: GrantFiled: October 28, 2014Date of Patent: April 24, 2018Assignee: Tokyo Electron LimitedInventors: Jiro Higashijima, Yuichi Douki, Masami Akimoto, Shigehisa Inoue
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Patent number: 9953848Abstract: A substrate liquid processing apparatus of the present disclosure supplies a plurality of processing liquids from a processing liquid supplying unit in a switching manner to a substrate held on a substrate holding unit. An elevatable inner cup surrounds the substrate holding unit laterally and forms a first drain path that drains the first processing liquid. An outer cup surrounds the inner cup and forms a second drain path that drains the second processing liquid. A cover covers the outside of the outer cup, includes an eaves portion that extends inwardly from an upper side, and forms an exhaust path between the cover and the outer cup. The exhaust path is connected to the first drain path and the second drain path above inlets of the first drain path and the second drain path.Type: GrantFiled: December 23, 2014Date of Patent: April 24, 2018Assignee: Tokyo Electron LimitedInventors: Terufumi Wakiyama, Norihiro Ito, Jiro Higashijima