Abstract: Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.

Abstract: Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.

Abstract: Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.

Abstract: Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.

Abstract: Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.

Abstract: Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.

Abstract: A reaction chamber including a reaction chamber in which preform is formed is provided. A cladding burner for forming a cladding of the preform is arranged in the reaction chamber, and a blocking member for suppressing ascending of the air in the reaction chamber is provided above the cladding burner. With this arrangement, abrupt flame-up of a flame containing glass particles produced through the burner is suppressed, the productivity of a preform is improved by accelerated formation of a preform, and the amount of glass particles which may adhere to a wall of the reaction chamber is reduced.

Abstract: An optical pickup feed device for feeding an optical pickup in a radial direction of an optical disc, includes guide rods enabling the optical pickup to move in a predetermined radial direction of an optical disc, and a driving system for producing a driving force to the optical pickup. The driving system comprises: a feed screw arranged in parallel with a direction in which the optical pickup moves, and is rotatable by a driving force from a driving motor; a nut engaging on the feed screw for moving the optical pickup, said nut including an engaging portion engageable with the feed screw and a bank portion provided on either side of the engaging portion, said bank portion being protruding toward the feed screw.

Abstract: A clamp unit for a disk comprises a disk table on which a disk is mounted and a clamper disposed in association with the disk table for clamping the disk under pressure therebetween. A film is formed on a surface of either one of the disk table and the clamper and formed of a mixture a synthetic resin and a plurality of fine particles disposed in the synthetic resin, both having viscous and elastic property, and some of the particles are exposed outside an outer surface of the film so as to provide an irregular surface having protruded portions.