Patents by Inventor Jiro Muto

Jiro Muto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding structure of an electronic device and a method for manufacturing the same
    Patent number: 5025348
    Abstract: A bonding structure and a bonding method for connecting an IC unit having an insulating sheet to connecting terminals arranged on a substrate. The insulating sheet has an elongated opening which is formed along one side of said insulating sheet and has on its one surface a plurality of conductive metal leads adhered thereto which stretch over the elongated opening. Portions of the metal leads which stretch over the elongated opening are solder-plated to serve as connecting portions. The connecting portions of the metal leads are heated and pressed into the opening with use of a heat-pressing head which has a width narrower than the opening, thereby being soldered to the connecting terminals. The metal lead is formed with inclined parts at its positions corresponding to both sides of the portion depressed by the heat-pressing head and solder pools are formed between the inclined parts and the connecting terminals.
    Type: Grant
    Filed: November 14, 1988
    Date of Patent: June 18, 1991
    Assignee: Casio Computer Co., Ltd.
    Inventors: Satoshi Suzuki, Osamu Kuwabara, Jiro Muto, Eiichi Shinozaki