Patents by Inventor Jiro Todoroki

Jiro Todoroki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip element holder and method of handling chip elements
    Publication number: 20080110015
    Abstract: Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be applied through the through holes to the electronic element main bodies bonded on an adhesive surface of the first holder. Meanwhile, the first holder is separated from the electronic element main bodies which are at the same time bonded on to an adhesive surface of the second holder.
    Type: Application
    Filed: December 27, 2007
    Publication date: May 15, 2008
    Inventors: Satoki Sakai, Jiro Todoroki
  • Chip element holder and method of handling chip elements
    Publication number: 20030062115
    Abstract: Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be applied through the through holes to the electronic element main bodies bonded on an adhesive surface of the first holder. Meanwhile, the first holder is separated from the electronic element main bodies which are at the same time bonded on to an adhesive surface of the second holder.
    Type: Application
    Filed: November 6, 2002
    Publication date: April 3, 2003
    Inventors: Satoki Sakai, Jiro Todoroki
  • Chip element holder and method of handling chip elements
    Patent number: 6503356
    Abstract: Exact transfer of electronic element main bodies, held by virtue of an adhesive property provided by an adhesive surface, is provided from a first holder to a second holder. A plurality of through holes are formed in the first holder, so that a pressing force provided by a pusher member can be applied through the through holes to the electronic element main bodies bonded on an adhesive surface of the first holder. Meanwhile, the first holder is separated from the electronic element main bodies which are at the same time bonded on to an adhesive surface of the second holder.
    Type: Grant
    Filed: October 11, 2000
    Date of Patent: January 7, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Satoki Sakai, Jiro Todoroki