Patents by Inventor Jiro Yokota

Jiro Yokota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220208517
    Abstract: A method for storage and supply of a F3NO-free FNO-containing gas comprises the steps of storing the F3NO-free FNO-containing gas in a NiP coated steel cylinder with a polished inner surface, releasing the F3NO-free FNO-containing gas from the cylinder to a manifold assembly by activating a cylinder valve in fluid communication with the cylinder and the manifold assembly, de-pressurizing the F3NO-free FNO-containing gas by activating a pressure regulator in the manifold assembly so as to divide the manifold assembly into a first pressure zone upstream of the pressure regulator and a second pressure zone downstream of the pressure regulator, and feeding the de-pressurized F3NO-free FNO-containing gas to a target reactor downstream of the second pressure zone.
    Type: Application
    Filed: January 13, 2022
    Publication date: June 30, 2022
    Inventors: Ayaka NISHIYAMA, Jiro YOKOTA, Chih-yu HSU, Peng SHEN, Nathan STAFFORD
  • Patent number: 11075084
    Abstract: Methods for fabricating a 3D NAND flash memory are disclosed. The method includes the steps of forming a hardmask pattern on the hardmask layer, and using the hardmask pattern to form apertures in the alternating layers by selectively plasma etching the alternating layers versus the hardmask layer using a hydrofluorocarbon etching gas selected from the group consisting of 1,1,1,3,3,3-hexafluoropropane (C3H2F6), 1,1,2,2,3,3-hexafluoropropane (iso-C3H2F6), 1,1,1,2,3,3,3-heptafluoropropane (C3HF7), and 1,1,1,2,2,3,3-heptafluoropropane (iso-C3HF7), wherein the first etching layer comprises a material different from that of the second etching layer.
    Type: Grant
    Filed: August 31, 2017
    Date of Patent: July 27, 2021
    Assignee: L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude
    Inventors: Peng Shen, Keiichiro Urabe, Jiro Yokota, Nicolas Gosset
  • Publication number: 20200203127
    Abstract: Disclosed are systems and methods for supplying a F3NO-free FNO-containing gas and systems and methods for etching using the F3NO-free FNO-containing gas. The system comprises a NiP coated steel cylinder with a polished inner surface to store the F3NO-free FNO-containing gas, a cylinder valve to release the F3NO-free FNO-containing gas from the cylinder, a manifold assembly, including a pressure regulator and line components to deliver the F3NO-free FNO-containing gas to a target reactor. The pressure regulator de-pressurizes the F3NO-free FNO-containing gas in the manifold assembly thereby dividing the manifold assembly into a first pressure zone upstream of the pressure regulator and a second pressure zone downstream of the pressure regulator. A gaseous composition comprises F3NO-free FNO gas containing less than approximately 1% F3NO impurity by volume and an inert gas being capable of suppressing the concentration of F3NO impurity in the F3NO-free FNO gas.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 25, 2020
    Inventors: Ayaka NISHIYAMA, Jiro Yokota, Chih-yu Hsu, Peng Shen, Nathan Stafford
  • Patent number: 10529581
    Abstract: Methods for isotropic etching at least a portion of a silicon-containing layer on a sidewall of high-aspect-ratio (HAR) apertures formed on a substrate in a reaction chamber are disclosed. The HAR aperture formed by plasma etching a stack of alternating layers of a first silicon-containing layer and a second silicon-containing layer, the second silicon-containing layer is different from the first silicon-containing layer. The method comprising the steps of: a) introducing a fluorine containing etching gas selected from the group consisting of nitrosyl fluoride (FNO), trifluoroamine oxide (F3NO), nitryl fluoride (FNO2) and combinations thereof into the reaction chamber; and b) removing at least a portion of the second silicon-containing layers by selectively etching the second silicon-containing layers versus the first silicon-containing layers with the fluorine containing etching gas to produce recesses between the first silicon-containing layers on the sidewall of the HAR aperture.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: January 7, 2020
    Assignees: L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude, Air Liquide Electronics U.S. LP
    Inventors: Chih-Yu Hsu, Peng Shen, Takashi Teramoto, Nathan Stafford, Jiro Yokota
  • Publication number: 20190206696
    Abstract: Methods for isotropic etching at least a portion of a silicon-containing layer on a sidewall of high-aspect-ratio (HAR) apertures formed on a substrate in a reaction chamber are disclosed. The HAR aperture formed by plasma etching a stack of alternating layers of a first silicon-containing layer and a second silicon-containing layer, the second silicon-containing layer is different from the first silicon-containing layer. The method comprising the steps of: a) introducing a fluorine containing etching gas selected from the group consisting of nitrosyl fluoride (FNO), trifluoroamine oxide (F3NO), nitryl fluoride (FNO2) and combinations thereof into the reaction chamber; and b) removing at least a portion of the second silicon-containing layers by selectively etching the second silicon-containing layers versus the first silicon-containing layers with the fluorine containing etching gas to produce recesses between the first silicon-containing layers on the sidewall of the HAR aperture.
    Type: Application
    Filed: December 29, 2017
    Publication date: July 4, 2019
    Inventors: Chih-Yu Hsu, Peng Shen, Takashi Teramoto, Nathan Stafford, Jiro Yokota
  • Publication number: 20170365487
    Abstract: Methods for fabricating a 3D NAND flash memory are disclosed. The method includes the steps of forming a hardmask pattern on the hardmask layer, and using the hardmask pattern to form apertures in the alternating layers by selectively plasma etching the alternating layers versus the hardmask layer using a hydrofluorocarbon etching gas selected from the group consisting of 1,1,1,3,3,3-hexafluoropropane (C3H2F6), 1,1,2,2,3,3-hexafluoropropane (iso-C3H2F6), 1,1,1,2,3,3,3-heptafluoropropane (C3HF7), and 1,1,1,2,2,3,3-heptafluoropropane (iso-C3HF7), wherein the first etching layer comprises a material different from that of the second etching layer.
    Type: Application
    Filed: August 31, 2017
    Publication date: December 21, 2017
    Applicant: L'Air Liquide, Societe Anonyme pour l'Etude et I'Exploitation des Procedes Georges Claude
    Inventors: Peng SHEN, Keiichiro URABE, Jiro YOKOTA, Nicolas GOSSET
  • Publication number: 20160040289
    Abstract: Bis(alkylimido)-bis(alkylamido)molybdenum compounds, their synthesis, and their use for the deposition of molybdenum-containing films are disclosed.
    Type: Application
    Filed: March 12, 2014
    Publication date: February 11, 2016
    Inventors: Julien GATINEAU, Changhee KO, Jiro YOKOTA, Clément LANSALOT-MATRAS
  • Publication number: 20160032454
    Abstract: Bis(alkylimido)-bis(alkylamido)tungsten compounds, their synthesis, and their use for the deposition of tungsten-containing films are disclosed.
    Type: Application
    Filed: March 15, 2013
    Publication date: February 4, 2016
    Inventors: Julien GATINEAU, Changhee KO, Jiro YOKOTA, Clément LANSALOT-MATRAS
  • Publication number: 20160002786
    Abstract: Bis(alkylimido)-bis(alkylamido)molybdenum compounds, their synthesis, and their use for the deposition of molybdenum-containing films are disclosed.
    Type: Application
    Filed: September 14, 2015
    Publication date: January 7, 2016
    Inventors: Julien GATINEAU, Changhee KO, Jiro YOKOTA, Clément LANSALOT-MATRAS
  • Publication number: 20090053386
    Abstract: It is intended to provide a treatment method of producing fresh shrimp, either natural or farmed ones, having enriched taste which can be easily introduced into the course of processing while maintaining the freshness, and to provide processed shrimp products having enriched umami (delicious taste) over a broad scope including fresh products, frozen products, and cooked products. Shrimp having enriched umami (delicious taste), in which the ratio of 5?-inosinic acid (IMP) in nucleic acid-relating substances is 40% or more; and a method of producing shrimp having enriched umami (delicious taste), in which the ratio of 5?-inosinic acid (IMP) in nucleic acid-relating substances is 40% or more, characterized by comprising maintaining the shrimp at a temperature of 10° C. to 50° C. for 0.1 to 24 hours.
    Type: Application
    Filed: May 1, 2006
    Publication date: February 26, 2009
    Applicant: MARUHA CORPORATION
    Inventors: Masahito Matsukawa, Noriki Koyama, Masahiko Shimada, Masayuki Kanamori, Jiro Yokota