Abstract: An ultrasonic welding device for ultrasonic welding of members to be welded, comprising: an ultrasonic horn configured to generate ultrasonic vibration; a horn chip configured to transmit the ultrasonic vibration to the members to be welded; and a connecting member provided between the ultrasonic horn and the horn chip for connecting them. The ultrasonic horn has a first screw part at the tip. The horn chip has a second screw part at the base end. The connecting member has a third screw part at one side to be screwed with the first screw part and a fourth screw part at the other side to be screwed with the second screw part. The ultrasonic horn and the horn chip are connected by the connecting member so that the attachment surface of the ultrasonic horn and the attachment surface of the horn chip are pressed to each other.

Abstract: The invention is intended to provide a high-capacity ultrasonic composite oscillating device that is sufficiently rigid as a composite oscillating body for various strong ultrasonic applications. One constructed such that BLTs (1, 1?, 2, 2?, . . . n, n?) of the same characteristics are disposed around an outer peripheral portion of a disk-shaped oscillating body 4 in n-sets opposed to each other and disposed at regular intervals, opposed BLTs being driven in an opposite phase mode, and driven in an oscillating mode in which the phase between the BLTs in adjacent sets is shifted by ?/n, and an oscillating rod connected to a center of the disk-shaped oscillating body is induced with a composite oscillation output of oscillation capacity n-times that of one set of BLTs induced in the center of the disk-shaped oscillating body 4, and one in which a plurality of these oscillating devices are jointed together to increase the oscillation capacity.

Abstract: The invention is intended to provide a high-capacity ultrasonic composite oscillating device that is sufficiently rigid as a composite oscillating body for various strong ultrasonic applications. One constructed such that BLTs (1, 1?, 2, 2?, . . . n, n?) of the same characteristics are disposed around an outer peripheral portion of a disk-shaped oscillating body 4 in n-sets opposed to each other and disposed at regular intervals, opposed BLTs being driven in an opposite phase mode, and driven in an oscillating mode in which the phase between the BLTs in adjacent sets is shifted by ?/n, and an oscillating rod connected to a center of the disk-shaped oscillating body is induced with a composite oscillation output of oscillation capacity n-times that of one set of BLTs induced in the center of the disk-shaped oscillating body 4, and one in which a plurality of these oscillating devices are jointed together to increase the oscillation capacity.

Abstract: An object of the present invention is to provide a sealing method by which an excellent bonding may be realized without thermal shock by bonding at a normal temperature due to ultrasonic coupling oscillation to seal a small size of surface mounting type quartz oscillator or the like. A bonding face (1a) of a sealing metal cap (1) is positioned on a bonded face (2a) of a package substrate (2), and ultrasonic oscillations of different directions are simultaneously imparted in the bonding plane while a suitable load is applied from an upper or a lower part of the bonding portion to the plane in a vertical direction so that the sealing metal cap (1) and the package substrate (2) are welded and fixed to be sealed on the bonding face.