Patents by Inventor Jirou Matsumoto

Jirou Matsumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molding die set and mold package
    Patent number: 5853771
    Abstract: A molding die set includes an upper die having an upper cavity; and a lower die including a lower cavity to be arranged to face the upper cavity, and a gate which guides plasticized resin into the lower cavity and the upper cavity. The lower cavity is provided with a projection region which is projecting inwardly. The gate is arranged to be extending in the projection region.
    Type: Grant
    Filed: April 21, 1998
    Date of Patent: December 29, 1998
    Assignee: Oki Electric Industry Co., Ltd.
    Inventor: Jirou Matsumoto