Abstract: A method of manufacturing a packaged semiconductor device includes mounting a semiconductor device having multiple leads. The leads are formed by mounting the semiconductor device in a lead frame and punching and sealing the leads in the semiconductor device using a resin. The leads are bent to a predetermined configuration while substantially simultaneously bending a connecting member that is used for connecting the leads to a frame. The resulting packaged semiconductor device has leads that are not cut off from the lead frame, and the connection between the two can be maintained even after a bending process is finished.

Abstract: The present invention relates to a packaged semiconductor comprising:

Abstract: The present invention relates to a packaged semiconductor comprising:

Abstract: The present invention relates to a packaged semiconductor that includes a semiconductor having a plurality of leads extending therefrom. The leads are formed by mounting the semiconductor device in a lead frame and punching and sealing the leads in the semiconductor device using a resin, wherein the leads have been bent to a predetermined configuration. A connector is further provided to connect leads to the frame, and the connector is bent at substantially the same time as when the leads are bent to the predetermined configuration. According to the packaged semiconductor, a lead is not cut off from a lead frame, and the connection between the two can be maintained even after a bending process is finished.

Abstract: A mold for molding a semiconductor package which is capable of guiding a resin material for encapsulating a semiconductor device uniformly into the cavity and prevents the island portion of the support member from being exposed from the molding main body, the mold comprising a pair of mold members for encapsulating a semiconductor device held on the support member, and a gate for guiding a molding resin material into the cavity, the gate being provided in the parting face of parting face of at least one of the mold members, wherein the gate is defined by a U-shape groove including the slanted bottom face inclined at an elevation angle toward the cavity to orient the flow of the resin material, supplied to the gate, toward the half of the cavity defined by the other mold member from the gate, and wherein in the slanted bottom face, there is provided an auxiliary groove for making the resin material, generally guided along the slanted bottom face, partially oriented to a direction different from the direction o