Abstract: The present invention provides an electroplating conductive fixture, comprising a base, a top cover and a conductive column. The bottom of the conductive column penetrates the base. A first guide part is arranged on the base. A second guide part is arranged on the conductive column. At least one of the first guide part and the second guide part extends in the shape of spiral from bottom to top. The bottom of the conductive column is provided with a scraper. In the present application, the scraper at the bottom of the conductive column is used to clean crystals on a conductive piece, which ensures good contact and improves the stability of a current and voltage during an electroplating process.