Patents by Inventor Jit DUTTA

Jit DUTTA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-dimensional strain sensing device, method for sensing types of external motions and for forming ternary valued logic device by the same, and ternary valued logic system
    Patent number: 12693179
    Abstract: A multi-dimensional strain sensing device includes a flexible substrate, two piezoelectric semiconducting films, a first pair of electrodes and a second pair of electrodes. The two piezoelectric semiconducting films are formed on opposite sides of the flexible substrate respectively. The first pair of electrodes are formed on one of the two piezoelectric semiconducting films and opposite to the flexible substrate. The second pair of electrodes are formed on the other one of the two piezoelectric semiconducting films and opposite to the flexible substrate. The present disclosure further proposes a method for sensing types of external motions by the multi-dimensional strain sensing device, a method for forming a ternary valued logic device by the multi-dimensional strain sensing device and a ternary valued logic system.
    Type: Grant
    Filed: July 7, 2023
    Date of Patent: July 28, 2026
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Jit Dutta, Chuan Pu Liu
  • MULTI-DIMENSIONAL STRAIN SENSING DEVICE, METHOD FOR SENSING TYPES OF EXTERNAL MOTIONS AND FOR FORMING TERNARY VALUED LOGIC DEVICE BY THE SAME, AND TERNARY VALUED LOGIC SYSTEM
    Publication number: 20250012645
    Abstract: A multi-dimensional strain sensing device includes a flexible substrate, two piezoelectric semiconducting films, a first pair of electrodes and a second pair of electrodes. The two piezoelectric semiconducting films are formed on opposite sides of the flexible substrate respectively. The first pair of electrodes are formed on one of the two piezoelectric semiconducting films and opposite to the flexible substrate. The second pair of electrodes are formed on the other one of the two piezoelectric semiconducting films and opposite to the flexible substrate. The present disclosure further proposes a method for sensing types of external motions by the multi-dimensional strain sensing device, a method for forming a ternary valued logic device by the multi-dimensional strain sensing device and a ternary valued logic system.
    Type: Application
    Filed: July 7, 2023
    Publication date: January 9, 2025
    Applicant: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Jit DUTTA, Chuan Pu LIU