Patents by Inventor Jitendra HANSALIA

Jitendra HANSALIA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible printed circuit to mitigate cracking at through-holes
    Patent number: 10798819
    Abstract: Flexible fingers for flexible printed circuits improve the crack resistance of prior art designs. The crack resistance can be improved by encapsulating the trace inside additional layers such that the outer two layers include only the lands of the through-hole, and all other copper is etched away. The crack resistance can also be improved with strategically adding copper on layers other than the trace layer including attaching is to the land of the through-hole as a stub. These two designs can be combined to include a stub trace into a four-layered design.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: October 6, 2020
    Assignee: COMMSCOPE, INC. OF NORTH CAROLINA
    Inventors: Brian J. Fitzpatrick, Jeffrey Cook, Jitendra Hansalia, Amid Ihsan Hashim
  • FLEXIBLE PRINTED CIRCUIT TO MITIGATE CRACKING AT THROUGH-HOLES
    Publication number: 20190297728
    Abstract: Flexible fingers for flexible printed circuits improve the crack resistance of prior art designs. The crack resistance can be improved by encapsulating the trace inside additional layers such that the outer two layers include only the lands of the through-hole, and all other copper is etched away. The crack resistance can also be improved with strategically adding copper on layers other than the trace layer including attaching is to the land of the through-hole as a stub. These two designs can be combined to include a stub trace into a four-layered design.
    Type: Application
    Filed: October 30, 2017
    Publication date: September 26, 2019
    Inventors: Brian J. FITZPATRICK, Jeffrey COOK, Jitendra HANSALIA, Amid Ihsan HASHIM