Patents by Inventor Jiun-Chung Wang

Jiun-Chung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9186905
    Abstract: A new structure (FIG. 11) for a thick-film thermal printhead and a variety of implementation approaches for controlling such a printhead. In the structure of the invention, the conductive lead at each end of the heater element is switched to either the power supply (Vhd) or ground, depending on the corresponding nib data bit. The improvement over a traditional center-tap structure (FIG. 1) is the reduction of density of conductive leads to achieve the resolution of printed dots. Compared to the printhead structure of alternated conductive system, either with diodes (FIG. 2) or without diodes (FIG. 4), which both suffer from the introduction of undesirable leaking currents, the printhead structure of the invention provides the advantage of eliminating leakage current completely. Control of the thermal printhead according to the invention is based on the sequential exclusive-OR (XOR) logic operation applied to the shifted-in nib data bit stream.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: November 17, 2015
    Assignee: Geospace Technologies, LP
    Inventors: Takeshi Toyosawa, Jiun-Chung Wang, Chung I. Tan