Patents by Inventor Jiun-Jie Huang

Jiun-Jie Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120329912
    Abstract: A fused filler and method for manufacturing the same are provided. The fused filler comprises about 50 wt % to about 60 wt % SiO2, about 10 wt % to about 20 wt % Al2O3, about 20 wt % to about 30 wt % B2O3 and about 1 wt % to about 5 wt % oxides of IA/IIA metals. The fused filler can be used in a resin composition for preparing prepregs and printed circuit boards.
    Type: Application
    Filed: September 8, 2011
    Publication date: December 27, 2012
    Applicant: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Cheng-Ping LIU, Jiun-Jie HUANG, Hsien-Te CHEN, Chih-Wei LIAO
  • Patent number: 8341562
    Abstract: A method includes retrieving first layouts of an integrated circuit from a non-transitory computer-readable medium. The first layouts include a via pattern in a via layer, and a metal line pattern in a metal layer immediately over the via layer. The metal line pattern has an enclosure to the via pattern. The enclosure is increased to a second enclosure to generate second layouts of the integrated circuit.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: December 25, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jiun-Jie Huang, Chi-Yen Lin, Ling-Sung Wang
  • Publication number: 20120024580
    Abstract: Disclosed is an epoxy resin composition for printed circuit board, which includes (A) an epoxy resin comprising a dicyclopentadiene type epoxy resin; (B) a copolymer of styrene and maleic anhydride as a curing agent; (C) a curing accelerator; (D) an optional silane dispersing agent; (E) an optional phosphorous-containing flame retardant; (F) an optional toughening agent; and (G) an optional inorganic filler.
    Type: Application
    Filed: November 1, 2010
    Publication date: February 2, 2012
    Inventors: Hsuan Hao HSU, Jiun Jie Huang, Mei Ling Chu, Hsien Te Chen