Patents by Inventor Jiun KONG

Jiun KONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9491856
    Abstract: A light system including a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer, and a light emitting device package mounted on the conduction layer. Further, the base layer includes iron (Fe).
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: November 8, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sangwoo Lee, Jiun Kong, Il Seo, Hongboem Jin, Dongwook Park
  • Patent number: 8963191
    Abstract: The light emitting device package includes a body provided with a cavity, a first lead frame mounted on the body, a second lead frame mounted on the body and separated from the first lead frame, and a light emitting device mounted in the cavity and disposed between the first lead frame and the second lead frame, the light emitting device is formed by sequentially stacking a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, the sequentially stacking direction of the first conductivity-type semiconductor layer, the active layer and the second conductivity-type semiconductor layer is parallel with the bottom surface of the cavity, the first lead frame includes a first connection part electrically connected to the first conductivity-type semiconductor layer, and the second lead frame includes a second connection part electrically connected to the second conductivity-type semiconductor layer.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: February 24, 2015
    Assignee: LG Innotek Co., Ltd.
    Inventors: Jiun Kong, Il Seo
  • Patent number: 8916778
    Abstract: Embodiments are about light emitting devices array. The light emitting device array according to embodiments may include a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer and a light emitting device package mounted on the conduction layer, wherein the base layer includes iron (Fe).
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: December 23, 2014
    Assignee: LG Innotek Co., Ltd.
    Inventors: Sangwoo Lee, Jiun Kong, Il Seo, Hongboem Jin, Dongwook Park
  • Publication number: 20140247610
    Abstract: A light system including a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer, and a light emitting device package mounted on the conduction layer. Further, the base layer includes iron(Fe).
    Type: Application
    Filed: May 12, 2014
    Publication date: September 4, 2014
    Applicant: LG Innotek Co., Ltd.
    Inventors: Sangwoo LEE, Jiun KONG, Il SEO, Hongboem JIN, Dongwook PARK
  • Publication number: 20130039078
    Abstract: Embodiments are about light emitting devices array. The light emitting device array according to embodiments may include a printed circuit board including a base layer, a first protection layer which is in contact with at least one surface of the base layer, an insulating layer disposed on the base layer, and a conduction layer disposed on the insulating layer and a light emitting device package mounted on the conduction layer, wherein the base layer includes iron (Fe).
    Type: Application
    Filed: February 7, 2012
    Publication date: February 14, 2013
    Inventors: Sangwoo Lee, Jiun Kong, Il Seo, Hongboem Jin, Dongwook Park
  • Publication number: 20120153337
    Abstract: The light emitting device package includes a body provided with a cavity, a first lead frame mounted on the body, a second lead frame mounted on the body and separated from the first lead frame, and a light emitting device mounted in the cavity and disposed between the first lead frame and the second lead frame, the light emitting device is formed by sequentially stacking a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, the sequentially stacking direction of the first conductivity-type semiconductor layer, the active layer and the second conductivity-type semiconductor layer is parallel with the bottom surface of the cavity, the first lead frame includes a first connection part electrically connected to the first conductivity-type semiconductor layer, and the second lead frame includes a second connection part electrically connected to the second conductivity-type semiconductor layer.
    Type: Application
    Filed: February 15, 2012
    Publication date: June 21, 2012
    Inventors: Jiun KONG, Il Seo