Abstract: A display device includes an LCD panel comprising blue color filters, green color filters and red color filters, and a light source for providing light to the LCD panel. The light has a spectrum with first, second and third components. The first component has at least one peak wavelength in a first wavelength range from about 480.1 nm to about 510 nm. The second component has a second wavelength range that is perceived as a green color. The third component has a third wavelength range that is perceived as a red or orange-red color by human eyes. The green color filters are adapted such that they do not transmit the first component of light or transmit a minimal amount of the first component of light so as to prevent a distortion or shift of a CIE coordinate of a filtered green light by the first component of light.

Abstract: Aspects of the invention include a display device including a liquid crystal display (LCD) panel comprising a plurality of blue color filters, a plurality of green color filters, and a plurality of red color filters; and a light source configured to provide light to the LCD panel. The light has a spectrum with a blue component, a green component and a red component. In one embodiment, the blue component has at least one peak wavelength in between 465 nm to 495 nm. In another embodiment, the blue component has an intensity being broadly distributed over a wavelength range of 430 nm to 495 nm. The plurality of green color filters has a transmission cut off wavelength being 480 nm or greater than 480 nm. The plurality of blue color filters has a transmission cut off wavelength being no greater than 500 nm.

Abstract: Aspects of the invention include a display device including a liquid crystal display (LCD) panel comprising a plurality of blue color filters, a plurality of green color filters, and a plurality of red color filters; and a light source configured to provide light to the LCD panel. The light has a spectrum with a blue component, a green component and a red component. In one embodiment, the blue component has at least one peak wavelength in between 465 nm to 495 nm. In another embodiment, the blue component has an intensity being broadly distributed over a wavelength range of 430 nm to 495 nm. The plurality of green color filters has a transmission cut off wavelength being 480 nm or greater than 480 nm. The plurality of blue color filters has a transmission cut off wavelength being no greater than 500 nm.

Abstract: Aspects of the invention include a multi-functional optical unit, panel lighting systems and display systems having the multi-functional optical unit. The multi-functional optical unit formed in a single-layered or multi-layered structure includes primary fillers and assisted fillers. The primary fillers include wavelength conversion materials adapted to function as at least one of mixing light, converting light, and trapping/guiding primary light. The assisted fillers are hybrids of fillers of sizes, shapes, and porosities having elongated shapes, fumed structures, or aspherical shapes for improving light trapping and propagating in an x-y plane direction of the multi-functional optical unit and light scattering/mixing. The multi-functional optical unit has a plurality of microstructures with a cross-section of a triangle, trapezium, trapezoid, square, curved, or rectangular shape to improve angular color uniformity, formed on one of its top and bottom surfaces.

Abstract: A package body for a semiconductor device includes a lead frame, an insulating package, and a reflective coating layer. The lead frame has a first electrode and a second electrode separated from each other. The insulating package provides a housing structure and forming a package cavity therein. The package cavity has a reflective side surface formed by the insulating package. The reflective coating layer partially covers the first electrode and the second electrode and forms a reflective bottom surface of the package cavity. Each of the first electrode and the second electrode may have an angled cut. The insulating package may be made of a binder-filler composite containing white pigments. The package body may be an all diffusive integrated reflecting surfaces (AR-IRS) package body, and may be used in an encapsulant-free semiconductor package.

Abstract: A package body for a semiconductor device includes a lead frame, an insulating package, and a reflective coating layer. The lead frame has a first electrode and a second electrode separated from each other. The insulating package provides a housing structure and forming a package cavity therein. The package cavity has a reflective side surface formed by the insulating package. The reflective coating layer partially covers the first electrode and the second electrode and forms a reflective bottom surface of the package cavity. Each of the first electrode and the second electrode may have an angled cut. The insulating package may be made of a binder-filler composite containing white pigments. The package body may be an all diffusive integrated reflecting surfaces (AR-IRS) package body, and may be used in an encapsulant-free semiconductor package.

Abstract: Conductive thick-film paste is useful in forming front-side contact of a solar cell or other semiconductor devices. Unlike conventional conductive frit pastes, a conductive paste according to the present invention does not include frit particles, and contains silver particles, nano-sized inorganic additives and an organic solvent. The conductive paste according to the present invention provides better etching ability through the anti-reflecting coating on the semiconductor substrate than conventional conductive frit pastes.

Abstract: The present disclosure includes an optical component including one or more microstructures configured to diffuse light incident thereto from within the optical component. The microstructures are provided at least on a light input surface of the optical component provided in a bottom cavity of its body.

Abstract: The present disclosure includes an optical component including one or more textured surfaces configured to diffuse light incident thereto from within the optical component. The optical component includes textured surfaces at least along a top periphery of its body.

Abstract: The present disclosure includes an optical component including one or more microstructures configured to diffuse light incident thereto from within the optical component. The microstructures are provided at least on a light input surface of the optical component provided in a bottom cavity of its body.

Abstract: The present disclosure includes an optical component including one or more textured surfaces configured to diffuse light incident thereto from within the optical component. The optical component includes textured surfaces at least along a top periphery of its body.

Abstract: A fuse structure and method for fabricating same are disclosed. The fuse structure is designed for opening by conventional laser energy application. The fuse structure is characterized by an absence of high stress areas in the surrounding substrate thereby resulting in higher fabrication yields due to lower occurrence of substrate fracturing or other damage occasioned by the opening of the fuse.

Abstract: A fuse structure and method for fabricating same are disclosed. The fuse structure is designed for opening by conventional laser energy application. The fuse structure is characterized by an absence of high stress areas in the surrounding substrate thereby resulting in higher fabrication yields due to lower occurrence of substrate fracturing or other damage occasioned by the opening of the fuse.

Abstract: A process for preparing a surface of a lower level metal structure, exposed at the bottom of a sub-micron diameter opening, to allow a low resistance interface to be obtained when overlaid with an upper level metal structure, has been developed. A disposable, capping insulator layer is first deposited on the composite insulator layer in which the sub-micron diameter opening will be defined in, to protect underlying components of the composite insulator from a subsequent metal pre-metal procedure. After anisotropically defining the sub-micron diameter opening in the capping insulator, and composite insulator layers, and after removal of the defining photoresist shape, an argon sputtering procedure is used to remove native oxide from the surface of the lower level metal structure. In addition to native oxide removal the argon sputtering procedure, featuring a negative DC bias applied to the substrate, also removes the capping insulator layer from the top surface of the composite insulator layer.