Abstract: In an embodiment, a device includes: a semiconductor device; and a redistribution structure including: a first dielectric layer; a first grounding feature on the first dielectric layer; a second grounding feature on the first dielectric layer; a first pair of transmission lines on the first dielectric layer, the first pair of transmission lines being laterally disposed between the first grounding feature and the second grounding feature, the first pair of transmission lines being electrically coupled to the semiconductor device; a second dielectric layer on the first grounding feature, the second grounding feature, and the first pair of transmission lines; and a third grounding feature extending laterally along and through the second dielectric layer, the third grounding feature being physically and electrically coupled to the first grounding feature and the second grounding feature, where the first pair of transmission lines extend continuously along a length of the third grounding feature.

Abstract: In an embodiment, a structure includes a core substrate, a redistribution structure coupled, the redistribution structure including a plurality of redistribution layers, the plurality of redistribution layers comprising a dielectric layer and a metallization layer, a first local interconnect component embedded in a first redistribution layer of the plurality of redistribution layers, the first local interconnect component comprising conductive connectors, the conductive connectors being bonded to a metallization pattern of the first redistribution layer, the dielectric layer of the first redistribution layer encapsulating the first local interconnect component, a first integrated circuit die coupled to the redistribution structure, a second integrated circuit die coupled to the redistribution structure, an interconnect structure of the first local interconnect component electrically coupling the first integrated circuit die to the second integrated circuit die, and a set of conductive connectors coupled to a

Abstract: A method of forming a semiconductor device includes arranging a semi-finished substrate, which has been tested and is known to be good, on a carrier substrate. Encapsulating the semi-finished substrate in a first encapsulant and arranging at least one semiconductor die over the semi-finished substrate. Electrically coupling at least one semiconductor component of the at least one semiconductor die to the semi-finished substrate and encasing the at least one semiconductor die and portions of the first encapsulant in a second encapsulant. Removing the carrier substrate from the semi-finished substrate and bonding a plurality of external contacts to the semi-finished substrate.

Abstract: A traffic signal system with dual light sources includes a signal displaying module, an ambient light module and a supplementary light module. The ambient light from environment is assembled by the ambient light module for generating a first light beam. A second light beam is provided by the supplementary light module disposed near the ground for easy maintaining and avoiding danger. The supplementary light module includes a sensor and a control circuit. The sensor senses the brightness of the first light beam passing through the signal displaying module and generates a photosensitive signal. The brightness of the second light beam is regulated by the control circuit according to the photosensitive signal. The brightness of the first light beam is supplied by regulating the brightness of the second light beam, so the signal displaying module has high-brightness light source and achieves the energy conservation.

Abstract: A traffic signal system with dual light sources includes a signal displaying module, an ambient light module and a supplementary light module. The ambient light from environment is assembled by the ambient light module for generating a first light beam. A second light beam is provided by the supplementary light module disposed near the ground for easy maintaining and avoiding danger. The supplementary light module includes a sensor and a control circuit. The sensor senses the brightness of the first light beam passing through the signal displaying module and generates a photosensitive signal. The brightness of the second light beam is regulated by the control circuit according to the photosensitive signal. The brightness of the first light beam is supplied by regulating the brightness of the second light beam, so the signal displaying module has high-brightness light source and achieves the energy conservation.