Abstract: The eject-lever apparatus of the present invention is arranged in an optical transceiver having a substrate, where the optical transceiver is being received in a housing having a slot arranged therein with the substrate being plugged into the slot, the apparatus comprising: at least a lever having a cam arranged therein, being disposed at the receiving end of the optic fiber of the optical transceiver; and at least a linkage rod, being deposed on a side of the optical transceiver, wherein the lever is actuated to rotate about an axis from a first location thereof to a second position thereof by exerting a force thereon while driving the cam to rotate accordingly for transmitting the force to an end of the linkage rod enabling the linkage rod to exert a force on the housing so as to generate a reacting force acting on the lever and thus cause the optical transceiver to move out to compress an elastic body and be ejected from the slot gradually; finally, the substrate is totally released from the slot for freei

Abstract: The eject-lever apparatus of the present invention is arranged in an optical transceiver having a substrate, where the optical transceiver is being received in a housing having a slot arranged therein with the substrate being plugged into the slot, the apparatus comprising: at least a lever having a cam arranged therein, being disposed at the receiving end of the optic fiber of the optical transceiver; and at least a linkage rod, being deposed on a side of the optical transceiver, wherein the lever is actuated to rotate about an axis from a first location thereof to a second position thereof by exerting a force thereon while driving the cam to rotate accordingly for transmitting the force to an end of the linkage rod enabling the linkage rod to exert a force on the housing so as to generate a reacting force acting on the lever and thus cause the optical transceiver to move out to compress an elastic body and be ejected from the slot gradually; finally, the substrate is totally released from the slot for freei

Abstract: A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is disclosed. The stiff heat spreader element is formed by bonding a heat spreader and a thermally conductive sheet with using a first bonding sheet. The first bonding sheet is a prepreg or prepregs made of fiber-reinforced resin. A second bonding sheet is used to bond a circuit substrate and the stiff heat spreader element. The second bonding sheet is made of a single adhesive layer or a stack of adhesive layers. The adhesive layer is made of an adhesive material, or a flake-filled adhesive material, or short fiber-filled adhesive material, or a particle-filled adhesive material. The second bonding sheet is not a prepreg or prepregs. The circuit substrate has an opening to receive an electronic chip.

Abstract: A stiff heat spreader element for making a cavity down plastic chip carrier having benefits of excellent heat dissipation property, low weight, small thickness, low warpage and low twist is disclosed. The stiff heat spreader element is formed by bonding a heat spreader and a thermally conductive sheet with using a first bonding sheet. The first bonding sheet is a prepreg or prepregs made of fiber-reinforced resin. A second bonding sheet is used to bond a circuit substrate and the stiff heat spreader element. The second bonding sheet is made of a single adhesive layer or a stack of adhesive layers. The adhesive layer is made of an adhesive material, or a flake-filled adhesive material, or short fiber-filled adhesive material, or a particle-filled adhesive material. The second bonding sheet is not a prepreg or prepregs. The circuit substrate has an opening to receive an electronic chip.