Patents by Inventor Jiun Wai Chew

Jiun Wai Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire Stitch Bond Having Strengthened Heel
    Publication number: 20150187729
    Abstract: A semiconductor chip (1100) assembled on a substrate (1110), the chip having bond pads (1102) and the substrate having contact pads (1111). Wires (1101) form arches to connect electrically the chip and the substrate, the wires forming first bonds (1103, e.g. ball bonds) on the chip bond pads and second bonds (1107, e.g. stitch bonds) on the substrate contact pads. The second (stitch) bonds have bendings (heels) 1106 with metal bulges (1106a) near the vertex of the bending.
    Type: Application
    Filed: January 2, 2014
    Publication date: July 2, 2015
    Inventor: Jiun Wai Chew