Abstract: A kind of microphone package structure includes at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bonding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste.

Abstract: A package for a MEMS microphone includes a cover, a substrate connected with the cover to define with the cover an accommodation chamber and having a channel in communication between the accommodation chamber and the space outside the cover, and a single chip disposed in the accommodation chamber and electrically connected with the substrate and corresponding to the channel of the substrate. Thus, an acoustic single can enter the accommodation chamber to reach the single chip through the channel for minimizing the dimensions of the package of the present invention.

Abstract: A cap package for MEMS includes a substrate having a connection zone that is grounded, a chip mounted on the substrate, a cap capped on the substrate and provided with a through hole corresponding to the chip, and a conducting glue made of a non-metal material having a resistivity smaller than 102 ?m. The conducting glue is applied on the connection zone of the substrate and sandwiched between the cap and the substrate for electrically connecting the cap with the substrate.

Abstract: A kind of microphone package structure includes at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bonding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste.

Abstract: A cap package includes a substrate on which a chip is mounted. A cap is made of silicon doped with non-metal dopant. The cap is capped on the substrate to define with the substrate an accommodation chamber that receives the chip inside. The chip is electrically connected with a conducting portion of the substrate which is grounded.

Abstract: A cap package for MEMS includes a substrate, a cap made of a carbon added plastic material and capped on the substrate to define with the substrate an accommodation chamber, and a chip mounted on the substrate and located inside the accommodation chamber. The substrate has a conducting portion electrically connected with the cap and grounded.

Abstract: A cap package for MEMS includes a substrate having a connection zone that is grounded, a chip mounted on the substrate, a cap capped on the substrate and provided with a through hole corresponding to the chip, and a conducting glue made of a non-metal material having a resistivity smaller than 102 ?m. The conducting glue is applied on the connection zone of the substrate and sandwiched between the cap and the substrate for electrically connecting the cap with the substrate.

Abstract: A MEMS module package includes a housing with an accommodation chamber and an opening in communication with the accommodation chamber. The housing has a substrate and an electrically insulative cap capped on the substrate and defining with the substrate the accommodation chamber therebetween. A micro electro-mechanical chip is installed on the substrate and located inside the accommodation chamber. The micro electro-mechanical chip has an action zone corresponding to the opening of the housing. A first conducting layer and a second conducting layer are respectively disposed on an inner surface and an outer surface of the electrically insulative cap.

Abstract: A kind of microphone package structure is disclosed. It comprises at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bounding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste.

Abstract: An acoustic head structure for a microphone is disclosed. It comprises a substrate, a sound-processing unit and an upper cap. The upper cap has a plurality of acoustic holes that are through-holes arranged about the upper lid. The position and shape of the acoustic holes can prevent foreign matter like dust from falling into the acoustic head structure.