Abstract: A semiconductor device package and a method of fabricating the same are provided. The semiconductor device package includes a substrate, a first chip, a jumper chip, a plurality of first bonding wires and a plurality of second bonding wires. The substrate has a plurality of contact pads. The first chip is disposed and electrically connected to the substrate via the first bonding wires. The jumper chip is disposed on the first chip and has a plurality of metal pads. Each of the metal pads is electrically connected to two contact pads of the substrate via two second bonding wires, respectively.

Abstract: A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a substrate, a first chip, a jumper chip, a plurality of first bonding wires and a plurality of second bonding wires. The substrate has a plurality of contact pads. The first chip is disposed and electrically connected to the substrate via the first bonding wires. The jumper chip is disposed on the first chip and has a plurality of metal pads. Each of the metal pads is electrically connected to two contact pads of the substrate via two second bonding wires, respectively.

Abstract: A recyclable stamp device and a recyclable stamp process for wafer bond are provided. The recyclable stamp device includes a substrate, a protective layer, a stack film structure and a cap. The protective layer is disposed on the substrate. An opening is positioned at the substrate and the protective layer to expose the substrate. The stack film structure includes an adhesion layer, a stress control layer and a wafer bond alignment mark layer. The adhesion layer is disposed on the protective layer and the exposed substrate. The stress control layer is disposed on the adhesion layer. The wafer bond alignment mark layer is disposed on the stress control layer. The wafer bond alignment mark layer includes an alignment mark at a side of the opening. The cap has a capping portion disposed on the wafer bond alignment mark layer corresponding to the opening.

Abstract: A wafer structure including a semiconductor substrate, a number of UBM layers and a number of bumps is provided. The semiconductor substrate has an active surface, a number of bonding pads and a passivation layer. The bonding pads are positioned on the active surface of the semiconductor substrate. The passivation layer covers the active surface of the semiconductor substrate and exposes the bonding pads. The UBM layers are respectively arranged on the bonding pads, and each UBM layer includes an adhesive layer, a super-lattice barrier layer and a wetting layer. The adhesion layer is disposed on bonding pads. The super-lattice barrier layer is disposed on the adhesion layer and includes a number of alternately stacked sub-barrier layers and sub-wetting layers. The wetting layer is disposed on the super-lattice barrier layer, and the bump is disposed on the wetting layer.

Abstract: A recyclable stamp device and a recyclable stamp process for wafer bond are provided. The recyclable stamp device includes a substrate, a protective layer, a stack film structure and a cap. The protective layer is disposed on the substrate. An opening is positioned at the substrate and the protective layer to expose the substrate. The stack film structure includes an adhesion layer, a stress control layer and a wafer bond alignment mark layer. The adhesion layer is disposed on the protective layer and the exposed substrate. The stress control layer is disposed on the adhesion layer. The wafer bond alignment mark layer is disposed on the stress control layer. The wafer bond alignment mark layer includes an alignment mark at a side of the opening. The cap has a capping portion disposed on the wafer bond alignment mark layer corresponding to the opening.

Abstract: A wafer structure including a semiconductor substrate, a number of UBM layers and a number of bumps is provided. The semiconductor substrate has an active surface, a number of bonding pads and a passivation layer. The bonding pads are positioned on the active surface of the semiconductor substrate. The passivation layer covers the active surface of the semiconductor substrate and exposes the bonding pads. The UBM layers are respectively arranged on the bonding pads, and each UBM layer includes an adhesive layer, a super-lattice barrier layer and a wetting layer. The adhesion layer is disposed on bonding pads. The super-lattice barrier layer is disposed on the adhesion layer and includes a number of alternately stacked sub-barrier layers and sub-wetting layers. The wetting layer is disposed on the super-lattice barrier layer, and the bump is disposed on the wetting layer.

Abstract: Disclosed is a system and method for creating and displaying interactive three dimensional (3D) computer images. In a preferred embodiment of the system a plurality of digital cameras are positioned in a single arcuate vertical plane, aimed at a center of an object to be imaged in the center of a rotating turntable. Images of the object are captured by each of the cameras after the turntable rotates a certain number of degrees, until the object has rotated a complete 360 degrees. The captured images are then sent to a computer where they are stored and from them, virtual images are created. These original images and virtual images are then compressed and re-sampled in order to be interactive 3D computer images. The 3D images of the object are then displayed and manipulated by the view through using a computer controller, such as a mouse, and various control icons.

Abstract: Disclosed is a system and method for creating and displaying interactive three dimensional (3D) computer images. In a preferred embodiment of the system a plurality of digital cameras are positioned in a single arcuate vertical plane, aimed at a center of an object to be imaged in the center of a rotating turntable. Images of the object are captured by each of the cameras after the turntable rotates a certain number of degrees, until the object has rotated a complete 360 degrees. The captured images are then sent to a computer where they are stored and from them, virtual images are created. These original images and virtual images are then compressed and re-sampled in order to be interactive 3D computer images. The 3D images of the object are then displayed and manipulated by the view through using a computer controller, such as a mouse, and various control icons.