Patents by Inventor Jiunn Wen Chan

Jiunn Wen Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8099694
    Abstract: In an example embodiment, an EDA program receives input which includes a selection as to an FPGA die and its device package and a selection as to a structured ASIC die and its device package. If the I/O pins on the device package for the FPGA differ from the I/O pins on the device package for the structured ASIC, the EDA program determines a correspondence between the I/O pins on the two device packages (e.g., by identifying the location of the pads for I/O pins on the structured ASIC die and/or creating a virtual structured ASIC device package whose I/O pins are a superset of the I/O pins on the selected structured ASIC device package), which determination includes checking rules for resource assignments. The EDA program then stores the determined correspondence in a device database where the determined correspondence can be accessed by CAD algorithms.
    Type: Grant
    Filed: April 15, 2009
    Date of Patent: January 17, 2012
    Assignee: Altera Corporation
    Inventors: Jiunn Wen Chan, James G. Schleicher, II, Kamal Patel