Patents by Inventor Jiunwei Chen

Jiunwei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260114056
    Abstract: A carrier board with light source image module includes a substrate, a cavity, a perforated section, an image sensor, and a light-emitting device. The substrate has a first surface and a second surface, which are opposite to each other. The cavity is disposed on the substrate and has a bottom surface. The altitude of the bottom surface is lower than the first surface. The perforated section is disposed on at least a part of the cavity, penetrating the first surface and the second surface. The image sensor is partially located in the cavity and partially located in the perforated section. The altitude of the surface of the image sensor is higher than the first surface. The light-emitting device is disposed on the first surface and adjacent to the image sensor. The surface of the light-emitting device is between the first surface and the surface of the image sensor.
    Type: Application
    Filed: October 21, 2024
    Publication date: April 23, 2026
    Inventors: Shangyi WU, Jiunwei CHEN, Hsin-Hsien Hsieh
  • Publication number: 20250383538
    Abstract: A manufacturing method of an endoscopic lens module involves arranging multiple lens barrel channels and alignment marks on a positioning base, placing lenses into the channels, and using adhesive material to fix them to form the lens module. A flat glass layer is placed on the other side of the positioning base, and the positioning base is then cut according to the alignment marks to create glue flowing runners. Light-shielding material is injected into the glue flowing runners and cured to form the array-type optical image sensor module. Finally, the light-shielding material is cut along the sidewalls of the glue flowing runners to separate the base units and create multiple optical image sensor modules of endoscopic lens assemblies. Therefore, the present invention enables the efficient mass production of high-quality optical image sensor modules of endoscopic lens assemblies and allows flexible configuration of image sensors to achieve optimal imaging results.
    Type: Application
    Filed: March 28, 2025
    Publication date: December 18, 2025
    Inventors: Shangyi WU, Hsin-Hsien HSIEH HSIEH, Jiunwei CHEN
  • Patent number: 12483772
    Abstract: An image sensor package includes a substrate, an image sensor, and at least one light-emitting element. The substrate has a plurality of electric-conduction contacts. The image sensor is arranged on the substrate electrically connected with the substrate. The light-emitting element includes a spacer and a light-emitting diode. The spacer has a plurality of electric-conduction contacts. The light emitting diode is arranged on the spacer and electrically connected with the spacer. The spacer is arranged on the substrate and electrically connected with the substrate. The spacer has a predetermined thickness, so that the height of a light input surface of the image sensor is larger than or equal to the height of a light output surface of the light-emitting diode. The above-mentioned image sensor package favors optimization of illumination. An endoscope including the above-mentioned image sensor package is also disclosed.
    Type: Grant
    Filed: March 21, 2023
    Date of Patent: November 25, 2025
    Assignee: MEDIMAGING INTEGRATED SOLUTION, INC.
    Inventors: Shangyi Wu, Jia-De Zhou, Chih Lung Hsu, Jiunwei Chen
  • Patent number: 12178407
    Abstract: An image sensor package includes a substrate, an image sensor, a plurality of light-emitting elements, and a scattering layer. The substrate includes a plurality of first conductive contacts, a plurality of second conductive contacts, and a plurality of third conductive contacts, wherein the second conductive contacts and the third conductive contacts are electrically connected with the corresponding first conductive contacts. The image sensor is disposed on the substrate and electrically connected to the second conductive contacts. The light-emitting elements are disposed on the substrate and electrically connected with the third conductive contacts. The scattering layer covers at least one sidewall of the light-emitting elements. The abovementioned image sensor package can provide better illumination effects. An endoscope including the abovementioned image sensor package is also disclosed.
    Type: Grant
    Filed: September 30, 2022
    Date of Patent: December 31, 2024
    Assignee: MEDIMAGING INTEGRATED SOLUTION, INC.
    Inventors: Shangyi Wu, Jiunwei Chen, Jia-De Zhou, Tseng Shen Tseng
  • Publication number: 20230308738
    Abstract: An image sensor package includes a substrate, an image sensor, and at least one light-emitting element. The substrate has a plurality of electric-conduction contacts. The image sensor is arranged on the substrate and electrically connected with the substrate. The light-emitting element includes a spacer and a light-emitting diode. The spacer has a plurality of electric-conduction contacts. The light emitting diode is arranged on the spacer and electrically connected with the spacer. The spacer is arranged on the substrate and electrically connected with the substrate. The spacer has a predetermined thickness, so that the height of a light input surface of the image sensor is larger than or equal to the height of a light output surface of the light-emitting diode. The above-mentioned image sensor package favors optimization of illumination. An endoscope including the above-mentioned image sensor package is also disclosed.
    Type: Application
    Filed: March 21, 2023
    Publication date: September 28, 2023
    Inventors: SHANGYI WU, JIA-DE ZHOU, CHIH LUNG HSU, JIUNWEI CHEN
  • Publication number: 20230108867
    Abstract: An image sensor package includes a substrate, an image sensor, a plurality of light-emitting elements, and a scattering layer. The substrate includes a plurality of first conductive contacts, a plurality of second conductive contacts, and a plurality of third conductive contacts, wherein the second conductive contacts and the third conductive contacts are electrically connected with the corresponding first conductive contacts. The image sensor is disposed on the substrate and electrically connected to the second conductive contacts. The light-emitting elements are disposed on the substrate and electrically connected with the third conductive contacts. The scattering layer covers at least one sidewall of the light-emitting elements. The abovementioned image sensor package can provide better illumination effects. An endoscope including the abovementioned image sensor package is also disclosed.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 6, 2023
    Inventors: Shangyi WU, Jiunwei CHEN, Jia-De ZHOU, Tseng Shen TSENG
  • Patent number: 8856268
    Abstract: A method and system are disclosed for allowing the sharing of games and gaming profiles between console and web-based gaming platforms. The present system includes a console service through which console games may be played, and a gaming website through which web-based games may be played. Players may play games through either the console service or gaming website using a single set of identity and profile data that is stored in a central data repository. Using a single repository for profile and other data, players may log in, play games, access their profiles and friends lists, and accrue rewards and game credits, regardless of whether they are using a console or web-based game. In a further aspect of the present system, users of consoles may play the same game and same game sessions with web-based users.
    Type: Grant
    Filed: April 22, 2008
    Date of Patent: October 7, 2014
    Assignee: Microsoft Corporation
    Inventors: Jiunwei Chen, Rocco Crea
  • Publication number: 20090264202
    Abstract: A method and system are disclosed for allowing the sharing of games and gaming profiles between console and web-based gaming platforms. The present system includes a console service through which console games may be played, and a gaming website through which web-based games may be played. Players may play games through either the console service or gaming website using a single set of identity and profile data that is stored in a central data repository. Using a single repository for profile and other data, players may log in, play games, access their profiles and friends lists, and accrue rewards and game credits, regardless of whether they are using a console or web-based game. In a further aspect of the present system, users of consoles may play the same game and same game sessions with web-based users.
    Type: Application
    Filed: April 22, 2008
    Publication date: October 22, 2009
    Applicant: MICROSOFT CORPORATION
    Inventors: Jiunwei Chen, Rocco Crea