Patents by Inventor Jiwei Liu

Jiwei Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12228817
    Abstract: A display device and a control method therefor are disclosed. The display device includes: a first backlight module; a second backlight module located at a light emergent side of the first backlight module; and a display panel located at a side of the second backlight module facing away from the first backlight module; where the first backlight module includes a first light board, and the first light board emits light to a side of the second backlight module; the second backlight module includes at least one second light board, second light boards of the at least one second light board are stacked, and the second light boards transmit the light emitted by the first backlight module and emit light to the display panel; the first light board includes a plurality of first light sources, each second light board of the second light boards includes a plurality of second light sources.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: February 18, 2025
    Assignees: Fuzhou BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Ming Chen, Nani Liu, Kai Diao, Han Zhang, Long Hu, Hongyu Zhao, Siyu Wu, Jingran Niu, Jiwei Sun, Yuhang Lin, Dingjie Zheng
  • Patent number: 11615159
    Abstract: A data processing method and apparatus for a mini app, a device and a medium are provided. An implementation of the method may include: intercepting a request message of the mini app, and sending the request message to a target server, where the request message comes from a technology stack; acquiring returned data targeting at the request message and returned from the target server, where the returned data includes cookie content, field information for indicating storage of the cookie content, and a data set corresponding to the request message; and storing the cookie content into a cookie storage database of the mini app according to the field information, and returning the returned data to the technology stack issuing the request message.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: March 28, 2023
    Assignee: BEIJING BAIDU NETCOM SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Du Chen, Rui Dong, Jiwei Liu
  • Publication number: 20230070872
    Abstract: The present disclosure relates to the technical field of a light-emitting diode (LED), and specifically provides a full-spectrum LED light source and a manufacturing method thereof. The full-spectrum LED light source includes a bracket, a chipset, and an encapsulation adhesive, where the chipset includes a first blue LED chip with a peak wavelength of 435 nm to 450 nm, a second blue LED chip with a peak wavelength of 450 nm to 460 nm, and a third blue LED chip with a peak wavelength of 460 nm to 475 nm that are connected in series or in parallel. The present disclosure has a good luminous efficiency and a low cost, and can increase values of special color rending indexes (CRIs) R9 and R12 in R1 to R15 to above 90.
    Type: Application
    Filed: June 19, 2020
    Publication date: March 9, 2023
    Applicant: Zhongshan Mulinsen Electronics Co., Ltd.
    Inventors: Baoqing Pi, Jiwei Liu, Hongli Shi
  • Patent number: 11199298
    Abstract: The present application discloses a method for manufacturing an LED filament, which includes: operation , a plurality of metal sheets are provided and arranged at least two rows in parallel; operation S2, a plurality of brackets are provided, and each bracket is located between two corresponding metal sheets and fixedly connected to the two metal sheets; operation S3, a plurality of LED chips are provided and attached to each of the brackets, and the LED chips are electrically connected to the metal sheets by conducting wire; operation S4, each bracket, the LED chips defined on the bracket, the conducting wire defined on the bracket, and the joints of the bracket and the metal sheets are all cladded using packaging material to form an encapsulation layer, and the encapsulation layer, the bracket, the LED chips, the conducting wire, and the connected two metal sheets cooperatively form an LED filament.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: December 14, 2021
    Assignee: ZHONGSHAN MLS ELECTRONIC CO., LTD
    Inventors: Jiwei Liu, Yu Yang, Ji-An Meng, Sheng Huang, Qinglin Yao, Hongli Shi
  • Publication number: 20210216606
    Abstract: A data processing method and apparatus for a mini app, a device and a medium are provided. An implementation of the method may include: intercepting a request message of the mini app, and sending the request message to a target server, where the request message comes from a technology stack; acquiring returned data targeting at the request message and returned from the target server, where the returned data includes cookie content, field information for indicating storage of the cookie content, and a data set corresponding to the request message; and storing the cookie content into a cookie storage database of the mini app according to the field information, and returning the returned data to the technology stack issuing the request message.
    Type: Application
    Filed: March 29, 2021
    Publication date: July 15, 2021
    Inventors: Du CHEN, Rui Dong, Jiwei LIU
  • Publication number: 20210172573
    Abstract: The present application discloses a method for manufacturing an LED filament, which includes: operation S1, a plurality of metal sheets are provided and arranged at least two rows in parallel; operation S2, a plurality of brackets are provided, and each bracket is located between two corresponding metal sheets and fixedly connected to the two metal sheets; operation S3, a plurality of LED chips are provided and attached to each of the brackets, and the LED chips are electrically connected to the metal sheets by conducting wire; operation S4, each bracket, the LED chips defined on the bracket, the conducting wire defined on the bracket, and the joints of the bracket and the metal sheets are all cladded using packaging material to form an encapsulation layer, and the encapsulation layer, the bracket, the LED chips, the conducting wire, and the connected two metal sheets cooperatively form an LED filament.
    Type: Application
    Filed: January 15, 2020
    Publication date: June 10, 2021
    Inventors: Jiwei Liu, Yu Yang, Ji-An Meng, Sheng Huang, Qinglin Yao, Hongli Shi