Patents by Inventor JIWEN ZHAO

JIWEN ZHAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11466615
    Abstract: An engine balancing system includes an engine body. At least two slider-crank mechanisms are provided inside the engine body. One of the slider-crank mechanisms is arranged opposite to the other slider-crank mechanism. A slider in one of the slider-crank mechanisms is moved at a speed and acceleration similar to a speed and acceleration of a slider in the other slider-crank mechanism. The slider-crank mechanism includes a connecting rod and a crankshaft with a crank. One end of one of the slider-crank mechanisms and one end of the other slider-crank mechanism are connected to the same crankshaft through the crank. The balancing system can effectively eliminate first-order, second-order and higher-order vibrations generated during engine operation, thus reducing the probability of equipment damage.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: October 11, 2022
    Assignee: CHONGQING ZONGSHEN GENERAL POWER MACHINE CO., LTD.
    Inventors: Jiwen Zhao, Yichao Wang, Yungang Ma, Fan Hu, Yun Lei
  • Patent number: 11139176
    Abstract: Direct growth methods for preparing diamond-assisted heat-dissipation silicon carbide substrates of GaN-HEMTs are disclosed. In an embodiment, the direct growth method includes the following steps: (1) etching holes in a surface of a silicon carbide substrate to produce a silicon carbide wafer; (2) ultrasonic cleaning the produced silicon carbide wafer; (3) establishing an auxiliary nucleation point on a surface of the silicon carbide wafer; (4) depositing a diamond layer; (5) removing the portion of the diamond layer on the upper surface while retaining the portion of the diamond layer in the holes; (6) ultrasonic cleaning; and (7) depositing diamond in the holes on the silicon carbide wafer until the holes are fully filled.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: October 5, 2021
    Assignee: Harbin Institute of Technology
    Inventors: Bing Dai, Jiwen Zhao, Jiaqi Zhu, Lei Yang, Wenxin Cao, Kang Liu, Jiecai Han, Guoyang Shu, Ge Gao, Kaili Yao, Benjian Liu
  • Publication number: 20210239040
    Abstract: An engine balancing system includes an engine body. At least two slider-crank mechanisms are provided inside the engine body. One of the slider-crank mechanisms is arranged opposite to the other slider-crank mechanism. A slider in one of the slider-crank mechanisms is moved at a speed and acceleration similar to a speed and acceleration of a slider in the other slider-crank mechanism. The slider-crank mechanism includes a connecting rod and a crankshaft with a crank. One end of one of the slider-crank mechanisms and one end of the other slider-crank mechanism are connected to the same crankshaft through the crank. The balancing system can effectively eliminate first-order, second-order and higher-order vibrations generated during engine operation, thus reducing the probability of equipment damage.
    Type: Application
    Filed: April 19, 2019
    Publication date: August 5, 2021
    Applicant: CHONGQING ZONGSHEN GENERAL POWER MACHINE CO., LTD.
    Inventors: Jiwen ZHAO, Yichao WANG, Yungang MA, Fan HU, Yun LEI
  • Publication number: 20200273717
    Abstract: Direct growth methods for preparing diamond-assisted heat-dissipation silicon carbide substrates of GaN-HEMTs are disclosed. In an embodiment, the direct growth method includes the following steps: (1) etching holes in a surface of a silicon carbide substrate to produce a silicon carbide wafer; (2) ultrasonic cleaning the produced silicon carbide wafer; (3) establishing an auxiliary nucleation point on a surface of the silicon carbide wafer; (4) depositing a diamond layer; (5) removing the portion of the diamond layer on the upper surface while retaining the portion of the diamond layer in the holes; (6) ultrasonic cleaning; and (7) depositing diamond in the holes on the silicon carbide wafer until the holes are fully filled.
    Type: Application
    Filed: February 25, 2020
    Publication date: August 27, 2020
    Inventors: BING DAI, JIWEN ZHAO, JIAQI ZHU, LEI YANG, WENXIN CAO, KANG LIU, JIECAI HAN, GUOYANG SHU, GE GAO, KAILI YAO, BENJIAN LIU