Patents by Inventor Jiwon Yang

Jiwon Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180345015
    Abstract: A resilient fabric band providing a sensor platform for a wearer in order to sense a plurality of biometric data, the band comprising: a pair of ECG sensors coupled to an interior surface of a body of the band, each of the pair of ECG sensors located on either side of a front to back centerline of the body; a pair of bio impedance sensors coupled to the interior surface of the body of the band, each of the pair of bio impedance sensors located on either side of the front to back centerline; a strain gauge sensor coupled to the body of the band; a computer device mounted on the body of the band via a housing, the computer device including a power source, a computer processor, a memory for storing instructions for execution by the computer processor, and a network interface for transmitting data sensed by the sensors; and a plurality of communication pathways connecting the computer device to each of the sensors, the communication pathway for sending power from the power supply to the sensors as controlled by t
    Type: Application
    Filed: June 6, 2018
    Publication date: December 6, 2018
    Inventors: Adrian Straka, Jiwon Yang, Parth Jain, Mark Klibanov, Michelle Zheng, Gabriel Stefan, Monica Nealis, Milad Alizadeh-Meghrazi
  • Patent number: 9696717
    Abstract: An apparatus and method of segmenting sensor data are provided. The apparatus includes a sensor, a first segmentation unit, a continuity evaluation unit, a second segmentation unit, and a segmentation determination unit. The sensor collects sensor data for a process of the semiconductor manufacturing facility. The first segmentation unit extracts a variation point of the sensor data to perform an abnormal difference (AD) segmentation on the sensor data based on the at least one variation point. The continuity evaluation unit evaluates a continuity ratio of the sensor data. The second segmentation unit performs a free-knot spline (FS) segmentation on the sensor data when the continuity ratio exceeds a reference ratio. The segmentation determination unit compares the AD segmentation result with the FS segmentation result and to select one of the results on the comparison result.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: July 4, 2017
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SEOUL NATIONAL UNIVERSITY R & DB FOUNDATION
    Inventors: Hae-Sang Park, Young-Hak Lee, Jung-Hee Kim, Heui-Sik Jeon, Eunjeong Lucy Park, Sungzoon Cho, Jooseoung Park, Jiwon Yang
  • Publication number: 20150039117
    Abstract: An apparatus and method of segmenting sensor data are provided. The apparatus includes a sensor, a first segmentation unit, a continuity evaluation unit, a second segmentation unit, and a segmentation determination unit. The sensor collects sensor data for a process of the semiconductor manufacturing facility. The first segmentation unit extracts a variation point of the sensor data to perform an abnormal difference (AD) segmentation on the sensor data based on the at least one variation point. The continuity evaluation unit evaluates a continuity ratio of the sensor data. The second segmentation unit performs a free-knot spline (FS) segmentation on the sensor data when the continuity ratio exceeds a reference ratio. The segmentation determination unit compares the AD segmentation result with the PS segmentation result and to select one of the results on the comparison result.
    Type: Application
    Filed: May 16, 2014
    Publication date: February 5, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hae-Sang Park, Young-Hak Lee, Jung-Hee Kim, Heui-Sik Jeon, Eunjeong Lucy Park, Sungzoon Cho, Jooseoung Park, Jiwon Yang
  • Patent number: D796869
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: September 12, 2017
    Inventors: Jeff Higashi, Steven J. Laureanti, Pongnut Krainichakul, Jiwon Yang