Patents by Inventor Ji Won Yu
Ji Won Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12020407Abstract: The present disclosure discloses an image data processing system, and discloses an image data processing system for a vehicle, which compensates image data by reflecting an ambient illumination.Type: GrantFiled: April 28, 2022Date of Patent: June 25, 2024Assignee: LX SEMICON CO., LTD.Inventors: Jun Ho Heo, Seung Wan Yu, Ji Won Lee, Yong Hee Kim, Kwon Chung
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Publication number: 20240203747Abstract: The present invention provides an isotropic etching method of two-dimensional semiconductor materials. The present invention provides an isotropic etching method of two-dimensional semiconductor materials including a first operation of arranging an etching object having a two-dimensional transition metal chalcogenide layer inside an etching space of a remote plasma system in which a discharge space and the etching space are separated, a second operation of extracting oxygen or halogen radical among plasma generated in the discharge space and reacting the two-dimensional transition metal chalcogenide layer with a surface to form an oxide layer and a radical adsorbate layer, and a third operation of selectively removing the oxide layer and the radical adsorbate layer in the etching space, wherein only an upper layer of the two-dimensional transition metal chalcogenide is precisely etched in units of atoms without defects and damage in a lower layer.Type: ApplicationFiled: December 13, 2023Publication date: June 20, 2024Applicant: Research & Business Foundation SUNGKYUNKWAN UNIVERSITYInventors: Geun Young YEOM, Ji Eun KANG, Seong Jae YU, You Jin JI, Hye Won HAN, Ji Min KIM
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Patent number: 12016187Abstract: The present application provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside, and has excellent spreadability, is applicable to thin organic electronic devices and has excellent hardness of the cured product after curing, without causing an inter-circuit interference problem.Type: GrantFiled: September 10, 2019Date of Patent: June 18, 2024Assignee: LG Chem, Ltd.Inventors: Ji Won Kwak, Joon Hyung Kim, Kook Hyun Choi, Mi Lim Yu, Yung Jong Lee
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Publication number: 20240161731Abstract: A method and an electronic device for translating a speech signal between a first language and a second language with minimized translation delay by translating fewer than all words of the speech signal according to a level of understanding of the second language by a user that receives the translation.Type: ApplicationFiled: January 17, 2024Publication date: May 16, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-sang YU, Sang-ha Kim, Jong-youb Ryu, Yoon-jung Choi, Eun-kyoung Kim, Jae-won Lee
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Publication number: 20240100572Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a cleaning unit configured to clean a bottom surface of the substrate supported on the support unit, and wherein the cleaning unit comprises: a body; and a protrusion formed to be upwardly protruding from the body, and the protrusion is positioned to be spaced apart from the bottom surface.Type: ApplicationFiled: March 13, 2023Publication date: March 28, 2024Applicant: SEMES CO., LTD.Inventors: Sung Hun EOM, Tae Won Yun, Ha Neul Yoo, Ji Hyeong Yu
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Patent number: 11915684Abstract: A method and an electronic device for translating a speech signal between a first language and a second language with minimized translation delay by translating fewer than all words of the speech signal according to a level of understanding of the second language by a user that receives the translation.Type: GrantFiled: January 26, 2022Date of Patent: February 27, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-sang Yu, Sang-ha Kim, Jong-youb Ryu, Yoon-jung Choi, Eun-kyoung Kim, Jae-won Lee
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Patent number: 11670673Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.Type: GrantFiled: January 13, 2021Date of Patent: June 6, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyun-suk Lee, Ji-won Yu, Ji-woon Park
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Patent number: 11111579Abstract: A deposition equipment is provided. The deposition equipment includes: a reaction chamber including an upper plate and a container body, the upper plate including a gas supplier for injecting a processing gas; a wafer chuck including an upper surface on which a wafer is loaded, in the reaction chamber, with the upper surface of the wafer chuck facing the upper plate; and a processing gas shielding section which prevents the processing gas from being adsorbed to the upper surface of the wafer chuck and is disposed between the upper plate and the wafer chuck in a state in which the wafer is removed from the wafer chuck. The processing gas shielding section includes a shutter which is plate-like, and the shutter includes a region including a gas discharge section for jetting a purging gas toward the wafer chuck.Type: GrantFiled: April 17, 2019Date of Patent: September 7, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sun Yong Hwang, Hyun Su Kim, Eun-Ok Lee, Taek Jung Kim, Hyo Jung Noh, Ji Won Yu
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Publication number: 20210159310Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.Type: ApplicationFiled: January 13, 2021Publication date: May 27, 2021Inventors: Hyun-suk LEE, Ji-won YU, Ji-woon PARK
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Publication number: 20210101237Abstract: A tool changing system of a machining center for machining a workpiece of a vehicle includes a machining unit including a jig portion for loading the workpiece and a tool loading device for loading a tool for machining the workpiece, a first magazine for storing a plurality of first tools, a second magazine for storing a plurality of second tools, and a controller configured to manage changing of the first tool between the machining unit and the first magazine and changing of the second tool between the machining unit.Type: ApplicationFiled: March 31, 2020Publication date: April 8, 2021Inventors: Moo Hyun Kim, Jekwang Cho, Ji Won Yu
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Patent number: 10903308Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.Type: GrantFiled: July 11, 2019Date of Patent: January 26, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyun-suk Lee, Ji-won Yu, Ji-woon Park
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Patent number: 10886555Abstract: An apparatus for activating a membrane electrode assembly (MEA) for fuel cells includes: a frame. A plurality of separation plates are disposed on an upper side of a base plate, which is disposed on a top portion of the frame, to move straightly in a length direction. The plurality of separation plates are spaced apart from each other with the MEA interposed therebetween in the direction in which the separation plates move. A tilt unit, which is connected to the frame and the base plate, upwardly tilt the base plate with respect to the frame and remove a coolant generated when the MEA is activated.Type: GrantFiled: June 20, 2018Date of Patent: January 5, 2021Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATIONInventors: Nam Doo Lee, Ji Won Yu
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Publication number: 20190345606Abstract: A deposition equipment is provided. The deposition equipment includes: a reaction chamber including an upper plate and a container body, the upper plate including a gas supplier for injecting a processing gas; a wafer chuck including an upper surface on which a wafer is loaded, in the reaction chamber, with the upper surface of the wafer chuck facing the upper plate; and a processing gas shielding section which prevents the processing gas from being adsorbed to the upper surface of the wafer chuck and is disposed between the upper plate and the wafer chuck in a state in which the wafer is removed from the wafer chuck. The processing gas shielding section includes a shutter which is plate-like, and the shutter includes a region including a gas discharge section for jetting a purging gas toward the wafer chuck.Type: ApplicationFiled: April 17, 2019Publication date: November 14, 2019Inventors: Sun Yong Hwang, Hyun Su Kim, Eun-Ok Lee, Taek Jung Kim, Hyo Jung Noh, Ji Won Yu
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Publication number: 20190333985Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.Type: ApplicationFiled: July 11, 2019Publication date: October 31, 2019Inventors: Hyun-suk LEE, Ji-won YU, Ji-woon PARK
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Patent number: 10373831Abstract: A method of manufacturing a semiconductor device, the method including supplying a first reactant to inside a processing chamber into which a substrate has been introduced; controlling a flow of a first purge gas and storing the first purge gas, of which flow has been controlled, in a first storage for a given time period; supplying the first purge gas from the first storage to the inside of the processing chamber after supplying the first reactant; and supplying a second reactant to the inside of the processing chamber after supplying the first purge gas.Type: GrantFiled: July 17, 2017Date of Patent: August 6, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Ji-won Yu, Hyun-suk Lee, Ji-woon Park, Gi-hee Cho, Hee-sook Park, Woong-hee Sohn
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Patent number: 10355073Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.Type: GrantFiled: March 3, 2017Date of Patent: July 16, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Hyun-suk Lee, Ji-won Yu, Ji-woon Park
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Patent number: 10239143Abstract: A slab scarfing apparatus comprises: an upper nozzle unit having an upper surface nozzle for scarfing an edge portion of the upper surface of a slab and having a first side nozzle scarfing an upper edge portion of the side surface of the slab and moving together with the upper surface nozzle; a lower nozzle unit having a lower nozzle for scarfing an edge portion of the lower surface of the slab and having a second side nozzle scarfing a lower edge portion of the side surface of the slab and moving together with the lower nozzle; and a moving apparatus for moving the upper nozzle unit and the lower nozzle unit to allow the upper nozzle unit and the lower nozzle unit to be adjacent to or to be spaced apart from an edge portion of the slab. A method of controlling the apparatus is provided.Type: GrantFiled: December 22, 2014Date of Patent: March 26, 2019Assignee: POSCOInventors: Seung-Ho Lim, Yeong-Seon Park, Seong-Yeon Kim, Ki-Hwan Kim, Ji-Won Yu
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Publication number: 20180301732Abstract: An apparatus for activating a membrane electrode assembly (MEA) for fuel cells includes: a frame. A plurality of separation plates are disposed on an upper side of a base plate, which is disposed on a top portion of the frame, to move straightly in a length direction. The plurality of separation plates are spaced apart from each other with the MEA interposed therebetween in the direction in which the separation plates move. A tilt unit, which is connected to the frame and the base plate, upwardly tilt the base plate with respect to the frame and remove a coolant generated when the MEA is activated.Type: ApplicationFiled: June 20, 2018Publication date: October 18, 2018Inventors: Nam Doo LEE, Ji Won YU
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Patent number: 10026985Abstract: An apparatus for activating a membrane electrode assembly (MEA) for fuel cells includes: a frame. A plurality of separation plates are disposed on an upper side of a base plate, which is disposed on a top portion of the frame, to move straightly in a length direction. The plurality of separation plates are spaced apart from each other with the MEA interposed therebetween in the direction in which the separation plates move. A tilt unit, which is connected to the frame and the base plate, upwardly tilt the base plate with respect to the frame and remove a coolant generated when the MEA is activated.Type: GrantFiled: September 29, 2015Date of Patent: July 17, 2018Assignee: Hyundai Motor CompanyInventors: Nam Doo Lee, Ji Won Yu
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Publication number: 20180019300Abstract: A semiconductor device includes a lower electrode structure, an upper electrode structure, and a dielectric layer between the lower and upper electrode structures and on side surfaces and an upper surface of the lower electrode structure. The lower electrode structure includes a first lower electrode pattern having a cylindrical shape, a barrier layer on the first lower electrode pattern, and a second lower electrode pattern in a space defined by the barrier layer.Type: ApplicationFiled: March 3, 2017Publication date: January 18, 2018Inventors: Hyun-suk LEE, Ji-won YU, Ji-woon PARK