Abstract: Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.

Abstract: Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.

Abstract: The thermal efficiency of dual-column chassis can be improved by re-locating line card to connection plane (LC-to-CP) interfaces to the center of the connection plane, as this allows inter line card channels (inter-LC channels) to be routed in a manner that avoids bisecting the thermal throughways over which convection cooling air is circulated to the line cards. One technique for centrally locating the LC-to-CP interfaces on the connection plane is to invert one column of line cards. Another technique for centrally locating the LC-to-CP interfaces on the connection plane is to use non-uniform line cards. An additional benefit of centrally locating the LC-to-CP interfaces on the connection plane is that the inter-LC channels extending between perpendicularly adjacent line cards are shortened, which increases server performance by virtue of reducing switching latency.

Abstract: The embodiments of the present invention provide an insert box with front and rear insertion and a heat dissipation method of the insert box. The insert box includes a front board area, a backboard, and a rear board area. A first air flow passing from a first wind inlet at an upper end portion at a front side of the insert box passes through one of the front board area and the rear board area; and a second air flow passing from a second wind inlet at a lower end portion at the front side of the insert box passes through the other one of the front board area and the rear board area.

Abstract: The thermal efficiency of dual-column chassis can be improved by re-locating line card to connection plane (LC-to-CP) interfaces to the center of the connection plane, as this allows inter line card channels (inter-LC channels) to be routed in a manner that avoids bisecting the thermal throughways over which convection cooling air is circulated to the line cards. One technique for centrally locating the LC-to-CP interfaces on the connection plane is to invert one column of line cards. Another technique for centrally locating the LC-to-CP interfaces on the connection plane is to use non-uniform line cards. An additional benefit of centrally locating the LC-to-CP interfaces on the connection plane is that the inter-LC channels extending between perpendicularly adjacent line cards are shortened, which increases server performance by virtue of reducing switching latency.

Abstract: A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.

Abstract: A chassis including a slot configured to receive a printed circuit board having a baffle position pin and electronic components mounted thereon, a guide mechanism mounted within the slot, and a carriage moveably mounted within the slot and biased toward a slot opening by the guide mechanism, the carriage including a baffle suitable to manipulate a flow of air through the slot, the carriage configured to be driven away from the slot opening and to be oriented relative to the electronic components on the printed circuit board by the baffle position pin when the printed circuit board is loaded into the slot such that the baffle directs the flow of air over the electronic components.

Abstract: The embodiments of the present invention provide an insert box with front and rear insertion and a heat dissipation method of the insert box. The insert box includes a front board area, a backboard, and a rear board area. A first air flow passing from a first wind inlet at an upper end portion at a front side of the insert box passes through one of the front board area and the rear board area; and a second air flow passing from a second wind inlet at a lower end portion at the front side of the insert box passes through the other one of the front board area and the rear board area.