Abstract: Disclosed is a method of performing double clustering to evaluate placement of semiconductor devices performed by a computing device according to an exemplary embodiment of the present disclosure. The method includes receiving connection relationship information representing a connection relationship between semiconductor devices, perform clustering on the semiconductor devices by utilizing first reference information based on the connection relationship information, and perform sub-clustering in a cluster generated by the clustering, by utilizing second reference information based on the connection relationship information.

Abstract: Disclosed is a method for automating a semiconductor design based on artificial intelligence, which is performed by a computing device. The method may include: receiving feature information and logical design information of a semiconductor element; and training a neural network model to place semiconductor elements in a canvas in an order by a large size based on the feature information and the logical design information.

Abstract: Disclosed is a method for automating a semiconductor design based on artificial intelligence, which is performed by a computing device. The method may include: generating a first embedding for a semiconductor element to be placed in a canvas based on feature information and logical design information of the semiconductor element by using a first neural network; and generating a probability distribution for placing the semiconductor element based on the first embedding and a second embedding for semiconductor elements already placed in the canvas by using a second neural network.

Abstract: Disclosed is a method of placing a semiconductor device, the method being performed by a computing device, the method including: receiving information about a prohibited area designated so that a semiconductor device is not placed; and training a neural network model to place a semiconductor device based on characteristic information of the semiconductor device and the information about the prohibited area.

Abstract: Disclosed is a method for automating a semiconductor design based on artificial intelligence, which is performed by a computing device. The method may include: receiving feature information and logical design information of a semiconductor element; and training a neural network model to place semiconductor elements in a canvas in an order by a large size based on the feature information and the logical design information.

Abstract: Disclosed is a method for automating a semiconductor design based on artificial intelligence, which is performed by a computing device. The method may include: generating a first embedding for a semiconductor element to be placed in a canvas based on feature information and logical design information of the semiconductor element by using a first neural network; and generating a probability distribution for placing the semiconductor element based on the first embedding and a second embedding for semiconductor elements already placed in the canvas by using a second neural network.