Patents by Inventor Ji Yu Chen

Ji Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10632735
    Abstract: A multi-purpose heat foil embossing machine and a heat foil adapter are disclosed herein. According to an embodiment, the heat foil adapter includes an injection molded body, a metal heat plate configured in the cavity of the molded body, a heating element, a temperature control system configured to maintain metal heat plate temperature, and a polycarbonate lid. According to another embodiment, the multi-purpose heat foil embossing machine is of platform and roller type construction wherein platform provides a flatbed working area and roller is moved over it that eliminates need to sandwich folder between plastic mats and push the mat between the rollers. According to another embodiment, the heat plate adapter is configured within a cavity on the platform of the embossing machine with electric connectivity.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: April 28, 2020
    Inventors: Earl Brohard, Ji Yu Chen
  • Publication number: 20190054733
    Abstract: A multi-purpose heat foil embossing machine and a heat foil adapter are disclosed herein. According to an embodiment, the heat foil adapter includes an injection molded body, a metal heat plate configured in the cavity of the molded body, a heating element, a temperature control system configured to maintain metal heat plate temperature, and a polycarbonate lid. According to another embodiment, the multi-purpose heat foil embossing machine is of platform and roller type construction wherein platform provides a flatbed working area and roller is moved over it that eliminates need to sandwich folder between plastic mats and push the mat between the rollers. According to another embodiment, the heat plate adapter is configured within a cavity on the platform of the embossing machine with electric connectivity.
    Type: Application
    Filed: October 23, 2018
    Publication date: February 21, 2019
    Inventors: Earl Brohard, Ji Yu Chen
  • Patent number: 10118379
    Abstract: A multi-purpose heat foil embossing machine and a heat foil adapter are disclosed herein. According to an embodiment the heat foil adapter includes an injection molded body, a metal heat plate configured in the cavity of the molded body, a heating element, a temperature control system configured to maintain metal heat plate temperature, and a polycarbonate lid. According to another embodiment, the multi-purpose heat foil embossing machine is of platform and roller type construction wherein platform provides a flatbed working area and roller is moved over it that eliminates need to sandwich folder between plastic mats and push the mat between the rollers. According to another embodiment, the heat plate adapter is configured within a cavity on the platform of the embossing machine with electric connectivity.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: November 6, 2018
    Inventors: Earl Brohard, Ji Yu Chen
  • Publication number: 20170028704
    Abstract: A multi-purpose heat foil embossing machine and a heat foil adapter are disclosed herein. According to an embodiment, the heat foil adapter includes an injection molded body, a metal heat plate configured in the cavity of the molded body, a heating element, a temperature control system configured to maintain metal heat plate temperature, and a polycarbonate lid. According to another embodiment, the multi-purpose heat foil embossing machine is of platform and roller type construction wherein platform provides a flatbed working area and roller is moved over it that eliminates need to sandwich folder between plastic mats and push the mat between the rollers. According to another embodiment, the heat plate adapter is configured within a cavity on the platform of the embossing machine with electric connectivity.
    Type: Application
    Filed: January 21, 2015
    Publication date: February 2, 2017
    Inventors: Earl Brohard, Ji Yu Chen