Patents by Inventor Jiyu SHIN

Jiyu SHIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting element for pixel and LED display module
    Patent number: 10790267
    Abstract: A light emitting element is disclosed. The light emitting element includes: a mount substrate on which a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad are disposed; a first vertical LED chip mounted on the mount substrate such that the bottom portion of the first vertical LED chip is connected to the first electrode pad; a second vertical LED chip mounted on the mount substrate such that the bottom portion of the second vertical LED chip is connected to the second electrode pad; a third vertical LED chip mounted on the mount substrate such that the bottom portion of the third vertical LED chip is connected to the third electrode pad; a light-transmitting conductive plate electrically connected to the top portions of the first vertical LED chip, the second vertical LED chip, and the third vertical LED chip; and a conductor connecting the light-transmitting conductive plate to the fourth electrode pad.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: September 29, 2020
    Assignee: LUMENS CO., LTD.
    Inventors: Taekyung Yoo, Seunghyun Oh, Sungsik Jo, Minpyo Kim, Jiyu Shin, Daewon Kim
  • LIGHT EMITTING ELEMENT FOR PIXEL AND LED DISPLAY MODULE
    Publication number: 20200013759
    Abstract: A light emitting element is disclosed. The light emitting element includes: a mount substrate on which a first electrode pad, a second electrode pad, a third electrode pad, and a fourth electrode pad are disposed; a first vertical LED chip mounted on the mount substrate such that the bottom portion of the first vertical LED chip is connected to the first electrode pad; a second vertical LED chip mounted on the mount substrate such that the bottom portion of the second vertical LED chip is connected to the second electrode pad; a third vertical LED chip mounted on the mount substrate such that the bottom portion of the third vertical LED chip is connected to the third electrode pad; a light-transmitting conductive plate electrically connected to the top portions of the first vertical LED chip, the second vertical LED chip, and the third vertical LED chip; and a conductor connecting the light-transmitting conductive plate to the fourth electrode pad.
    Type: Application
    Filed: July 27, 2018
    Publication date: January 9, 2020
    Applicant: LUMENS CO., LTD.
    Inventors: Taekyung YOO, Seunghyun OH, Sungsik JO, Minpyo KIM, Jiyu SHIN, Daewon KIM