Abstract: A system and method for preventing hacking of blockchain is proposed.

Abstract: Provided is a battery pack and a vehicle including the same. The battery pack includes a plurality of pouch-type battery cells, a pack case having an inner space in which the plurality of pouch-type battery cells are accommodated, and a cell cover at least partially surrounding and supporting at least some of the plurality of pouch-type battery cells. The cell cover includes a first cover portion covering one side surface of at least one of the plurality of battery cells, a second cover portion covering the other side surface of at least one of the plurality of battery cells, and a third cover portion connecting the first cover portion to the second cover portion and covering an upper end portion of the at least one battery cell. A first venting hole through which gas or flame is discharged is formed in at least one portion of the third cover portion.

Abstract: A battery pack includes a plurality of pouch-type battery cells; a pack case accommodating the pouch-type battery cells in the internal space; and a cell cover. The cell cover includes two unit covers at least partially spaced apart, provided to at least partially surround at least some of the pouch-type battery cells among the plurality of pouch-type battery cells in the internal space of the pack case. The cell cover is configured to allow venting gas to be discharged into the separation space between the two unit covers, thereby ensuring excellent safety when a thermal event occurs. Moreover, the present application discloses a battery module and a vehicle including the same.

Abstract: A cell assembly according to the present disclosure includes a cell stack including one pouch-type battery cell or two or more pouch-type battery cells stacked; and a cell cover covering two side portions of the cell stack along a widthwise direction of the cell stack and a top portion of the cell stack, wherein the cell cover is configured to adjust a width of the cell cover according to a width of the cell stack.

Abstract: Disclosed are a photosensitive resin composition including a composite dye that includes a red fluorescent dye re-emitting light at a 400 to 800 nm fluorescent wavelength; and a metal complex dye including at least one metal ion selected from Mg, Ni, Co, Zn, Cr, Pt, and Pd, and a color filter using the same.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.

Abstract: The present invention discloses a photosensitive resin composition for an insulating film of a display device including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a color material having a maximum absorption wavelength of 400 to 550 nm; and (D) a solvent, an insulation film using the same, and a display device including the insulation film.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin, (B) a photosensitive diazoquinone compound, (C) a thermosetting cross-linking agent represented by the following Chemical Formula 1, wherein each substituent of Chemical Formula 1 is the same as defined in the detailed description, and (D) a solvent, a photosensitive resin film using the same, and a display device.

Abstract: Disclosed is a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 1:50 to about 50:1.

Abstract: Disclosed are a photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a phenol compound; (D) a thermal acid generator; and (E) a solvent, wherein the solvent includes an organic solvent having a boiling point of less than about 160° C. under an atmospheric pressure and an organic solvent having a boiling point of greater than or equal to about 160° C. under an atmospheric pressure, wherein the organic solvent having a boiling point of less than about 160° C. is included in an amount of greater than or equal to about 90 wt % and less than about 100 wt % based on the total amount of the solvent, and the organic solvent having a boiling point of greater than or equal to about 160° C. is included in an amount of greater than about 0 wt % and less than or equal to about 10 wt % based on the total amount of the solvent, a photosensitive resin film using the same, and a display device.

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin selected from a polybenzoxazole precursor, a polyimide precursor, and a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) an organic dye and (E) a solvent, wherein the organic dye (D) includes at least one red dye having an absorption wavelength of 590 to 700 nm, at least one yellow dye having an absorption wavelength of 550 to 590 nm, and at least one blue dye having an absorption wavelength of 450 to 500 nm.

Abstract: The present invention discloses a photosensitive resin composition for an insulating film of a display device including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a color material having a maximum absorption wavelength of 400 to 550 nm; and (D) a solvent, an insulation film using the same, and a display device including the insulation film.

Abstract: Disclosed is a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a cross-linking agent; (D) a thermal acid generator; (E) a phenol compound; and (F) an organic solvent, wherein the cross-linking agent and thermal acid generator are included in a weight ratio of about 1:50 to about 50:1.

Abstract: Disclosed are a photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a phenol compound; (D) a thermal acid generator; and (E) a solvent, wherein the solvent includes an organic solvent having a boiling point of less than about 160° C. under an atmospheric pressure and an organic solvent having a boiling point of greater than or equal to about 160° C. under an atmospheric pressure, wherein the organic solvent having a boiling point of less than about 160° C. is included in an amount of greater than or equal to about 90 wt % and less than about 100 wt % based on the total amount of the solvent, and the organic solvent having a boiling point of greater than or equal to about 160° C. is included in an amount of greater than about 0 wt % and less than or equal to about 10 wt % based on the total amount of the solvent, a photosensitive resin film using the same, and a display device.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin, (B) a photosensitive diazoquinone compound, (C) a thermosetting cross-linking agent represented by the following Chemical Formula 1, wherein each substituent of Chemical Formula 1 is the same as defined in the detailed description, and (D) a solvent, a photosensitive resin film using the same, and a display device.

Abstract: Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin prepared by a phosphorous-containing diamine represented by the following Chemical Formula 1, (B) a photosensitive diazoquinone compound, and (C) a solvent. A photosensitive resin film prepared using the same and a semiconductor device including the photosensitive resin film are also disclosed. In Chemical Formula 1, each substituent is the same as defined in the detailed description.

Abstract: Disclosed are a positive photosensitive resin composition including (A) a polybenzoxazole precursor having a polydispersity of about 1 to about 1.6; (B) a photosensitive diazoquinone compound; (C) a thermal acid generator; and (D) a solvent, a photosensitive resin film using the same, and a display device.

Abstract: A photosensitive resin composition for an insulating film of a display device includes (A) an alkali soluble resin including a polybenzoxazole precursor, polyamic acid, polyimide, or a combination thereof; (B) a photosensitive diazoquinone compound; (C) an ultraviolet (UV) absorber having a maximum absorption wavelength of about 300 to about 400 nm; and (D) a solvent. An insulating film and a display device can include the photosensitive resin composition.

Abstract: Provided are a photosensitive resin composition for a color filter and a color filter using the same. The photosensitive resin composition for a color filter includes (A) a colorant including a diaminopyridine azo-based dye including a structure represented by Chemical Formula 1, and having an absorption wavelength at about 450 to about 550 nm, (B) an acrylic-based binder resin, (C) an acrylic-based photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a solvent.

Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin; (B) a photosensitive diazoquinone compound; (C) a first dissolution-controlling agent including at least one of compounds represented by the following Chemical Formula 1 or Chemical Formula 2; (D) a second dissolution-controlling agent including a compound represented by the following Chemical Formula 3; and (E) a solvent, and a photosensitive resin film and a display device using the same.