Patents by Inventor Jl-HWAN HWANG

Jl-HWAN HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS FOR STACKING SEMICONDUCTOR CHIPS IN A SEMICONDUCTOR PACKAGE
    Publication number: 20170236798
    Abstract: An apparatus for stacking semiconductor chips includes a push member configured to apply pressure to a semiconductor chip disposed on a substrate. The push member includes a push plate configured to contact the semiconductor chip, and a push rod connected to the push plate. The push plate includes a central portion having an area smaller than an area of an upper side of the semiconductor chip, and a plurality of protrusions disposed at respective ends of the central portion.
    Type: Application
    Filed: November 11, 2016
    Publication date: August 17, 2017
    Inventors: GUN-AH LEE, Jl-HWAN HWANG, CHA-JEA JO, DONG-HAN KIM, SEUNG-KON MOK