Patents by Inventor Jlin-Fuh Yau

Jlin-Fuh Yau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for improving adhesion between ceramic carrier and thick film circuit
    Patent number: 10362684
    Abstract: The present invention relates to a method for improving adhesion between ceramic and a thick film circuit. The method is particularly directed to accelerate the formation of a ceramic-metal eutectic phase between the ceramic carrier and the metal circuit by solid-phase diffusion bonding under a positive atmosphere. A metallic conductive slurry or its oxide slurry is printed on the surface of the ceramic carrier to form a circuit pattern by a thick film screen printing. The ceramic carrier is placed in an oven with temperature controlled by a program under a positive-pressure atmosphere of an inert gas including nitrogen, hydrogen or their mixtures. An eutectic phase is formed between the ceramic carrier and the metal circuit under a high temperature eutectic condition to increase the adhesion between the ceramic carrier and the thick film circuit.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: July 23, 2019
    Assignee: National Chung-Shan Institute of Science and Technology
    Inventors: Chia-Ting Lin, Jlin-Fuh Yau, Chung-Yen Lu, Yang-Kuo Kuo