Patents by Inventor Jo Gyun Kim

Jo Gyun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the same
    Patent number: 7825528
    Abstract: An epoxy resin composition, and a method of making the same, includes an epoxy resin and a curing agent, the epoxy resin composition also includes inorganic fillers, curing accelerators, and modified silicone oils. The epoxy resin is a modified epoxy resin prepared by glycidyl etherification of a mixture of a novolac type phenolic compound having a biphenyl derivative in the molecule and a 4,4?-dihydroxy biphenyl compound, and the curing agent is a mixture of a polyaromatic curing agent and a polyfunctional curing agent.
    Type: Grant
    Filed: August 1, 2006
    Date of Patent: November 2, 2010
    Assignee: Cheil Industries, Inc.
    Inventors: Jo Gyun Kim, Kun Bae Noh, Yoon Kok Park