Abstract: A method for manufacturing a heat releasing semiconductor chip package includes attaching a first surface of a semiconductor chip onto an insulating film, injecting a coating liquid onto a second surface of the semiconductor chip to form a liquefied coating layer and curing the liquefied coating layer to form a heat releasing layer. The coating liquid includes a liquefied molding compound for heat releasing and fine alumina particles. Therefore, the heat releasing semiconductor chip package and method for manufacturing the semiconductor chip package form a heat releasing layer in direct contact with the semiconductor chip to maximize a heat releasing effect.

Abstract: A method for manufacturing a heat releasing semiconductor chip package includes attaching a first surface of a semiconductor chip onto an insulating film, injecting a coating liquid onto a second surface of the semiconductor chip to form a liquefied coating layer and curing the liquefied coating layer to form a heat releasing layer. The coating liquid includes a liquefied molding compound for heat releasing and fine alumina particles. Therefore, the heat releasing semiconductor chip package and method for manufacturing the semiconductor chip package form a heat releasing layer in direct contact with the semiconductor chip to maximize a heat releasing effect.

Abstract: A method for manufacturing a heat releasing semiconductor chip package includes attaching a first surface of a semiconductor chip onto an insulating film, injecting a coating liquid onto a second surface of the semiconductor chip to form a liquefied coating layer and curing the liquefied coating layer to form a heat releasing layer. The coating liquid includes a liquefied molding compound for heat releasing and fine alumina particles. Therefore, the heat releasing semiconductor chip package and method for manufacturing the semiconductor chip package form a heat releasing layer in direct contact with the semiconductor chip to maximize a heat releasing effect.

Abstract: A method for manufacturing a heat releasing semiconductor chip package includes attaching a first surface of a semiconductor chip onto an insulating film, injecting a coating liquid onto a second surface of the semiconductor chip to form a liquefied coating layer and curing the liquefied coating layer to form a heat releasing layer. The coating liquid includes a liquefied molding compound for heat releasing and fine alumina particles. Therefore, the heat releasing semiconductor chip package and method for manufacturing the semiconductor chip package form a heat releasing layer in direct contact with the semiconductor chip to maximize a heat releasing effect.

Abstract: Disclosed herein is an auxiliary apparatus of a carrier mounted to a rear portion of a vehicle, including a locking unit fastened to the carrier, the locking unit including a locking pin to be extracted or retracted in response to operation of a switch unit, a rotary plate rotatably coupled to the locking unit, and a fastening member mounted to the rotary plate, the fastening member having at least a fastening hole into which the locking pin is selectively inserted and locked according to the operation of the switch unit.

Abstract: A storage apparatus for a vehicle can maximize a space use of a vehicle by a structure in which the storage apparatus is mounted by using an inner space of a rear bumper, in particular, greatly improving the value of commodities of the vehicle by using a bumper door as a step or a bench at the time of opening a storage case or using articles while putting the articles on the opened bumper door.

Abstract: A storage apparatus for a vehicle may include a rear bumper having a back beam mounted under an inner space thereof, and a storage case provided in a space above the rear bumper, having a portion exposed to the outside formed so as to coincide with an outer surface of the rear bumper, and drawn-out/drawn-in by being slid to the outside in a state in which a load is supported above the back beam.

Abstract: A storage apparatus for a vehicle can maximize a space use of a vehicle by a structure in which the storage apparatus is mounted by using an inner space of a rear bumper, in particular, greatly improving the value of commodities of the vehicle by using a bumper door as a step or a bench at the time of opening a storage case or using articles while putting the articles on the opened bumper door.

Abstract: A storage apparatus for a vehicle may include a rear bumper having a back beam mounted under an inner space thereof, and a storage case provided in a space above the rear bumper, having a portion exposed to the outside formed so as to coincide with an outer surface of the rear bumper, and drawn-out/drawn-in by being slid to the outside in a state in which a load is supported above the back beam.

Abstract: Disclosed herein is a bicycle carrier for a vehicle, which is housed in the rear bumper of the vehicle to be concealed and when necessary is drawn out from the rear bumper to carry a bicycle. The bicycle carrier includes a front frame positioned in a rear bumper of the vehicle and secured to a rear end of a vehicle body. A central frame perpendicularly passes through the front frame. A rear frame is secured to a rear end of the central frame. A folding unit couples each of opposite ends of the front frame with each of opposite ends of the rear frame and is folded to vary a distance between the front frame and the rear frame. A bicycle wheel support is provided on the folding unit. A bicycle body support is provided on the central frame.

Abstract: Disclosed herein is a bicycle carrier for a vehicle, which is housed in the rear bumper of the vehicle to be concealed and when necessary is drawn out from the rear bumper to carry a bicycle. The bicycle carrier includes a front frame positioned in a rear bumper of the vehicle and secured to a rear end of a vehicle body. A central frame perpendicularly passes through the front frame. A rear frame is secured to a rear end of the central frame. A folding unit couples each of opposite ends of the front frame with each of opposite ends of the rear frame and is folded to vary a distance between the front frame and the rear frame. A bicycle wheel support is provided on the folding unit. A bicycle body support is provided on the central frame.

Abstract: Disclosed herein is an auxiliary apparatus of a carrier mounted to a rear portion of a vehicle, including a locking unit fastened to the carrier, the locking unit including a locking pin to be extracted or retracted in response to operation of a switch unit, a rotary plate rotatably coupled to the locking unit, and a fastening member mounted to the rotary plate, the fastening member having at least a fastening hole into which the locking pin is selectively inserted and locked according to the operation of the switch unit.

Abstract: A semiconductor substrate and a stackable semiconductor package and a fabrication method thereof which make it possible to form a highly-integrated semiconductor module within a limited area. The semiconductor substrate includes a non-conductive substrate main body having a plurality of patterned conductive wires formed therein, a cavity formed in an upper center portion of the substrate main body, and a plurality of via holes which perpendicularly pass through edge portions of the substrate main body. A stackable semiconductor package includes the above-described semiconductor substrate, having a semiconductor device positioned in its cavity with a molding compound, the semiconductor device being electrically connected to the conductive wires formed in the semiconductor substrate. Plural stackable semiconductor packages may be stacked such that the via holes are aligned, and a conductive material such as solder can be placed in the via holes to ensure electrical connection.

Abstract: An IC memory card capable of improving memory storage capacity and data processing speed by including a connector for interfacing with an external apparatus and providing 64-bits of data signals, 30-bits of address signals, and 8-bits of chip selection signals, which further includes a control unit for controlling read and write operations in accordance with control signals inputted via the connector; and a plurality of memory chips for inputting internal chip selection signals outputted from the control unit, being enabled by corresponding chip selection signals, and inputting/outputting data in accordance with the read and write signals outputted from the control unit.