Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.

Abstract: Disclosed are an all-solid-state battery and a method of manufacturing the same, in which the all-solid-state battery includes a coating layer configured such that the surface of a porous network formed by intertwining fibrous carbon is coated with an inorganic electrolyte, thus improving charge/discharge efficiency and lifespan characteristics thereof.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.

Abstract: The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.

Abstract: The present invention relates to novel heterocyclic compounds useful in preparing drugs for the prevention or treatment of diseases associated with STAT3 protein. Specifically, these drugs are useful in the prevention or treatment of solid tumors, blood cancers, radiation or drug-resistant cancers, metastatic cancers, inflammatory diseases, immune system diseases, diabetes, macular degeneration, papillomavirus infections and tuberculosis.

Abstract: A heterocyclic derivative represented by formula (I), or a pharmaceutically acceptable salt or a stereoisomer thereof, which has an inhibitory effect on the activation of STAT3 protein, and is useful for the prevention or treatment of diseases associated with the activation of STAT3 protein.

Abstract: A heterocyclic derivative represented by formula (I), or a pharmaceutically acceptable salt or a stereoisomer thereof, which has an inhibitory effect on the activation of STAT3 protein, and is useful for the prevention or treatment of diseases associated with the activation of STAT3 protein.

Abstract: A heterocyclic derivative represented by formula (I), or a pharmaceutically acceptable salt or a stereoisomer thereof, which has an inhibitory effect on the activation of STAT3 protein, and is useful for the prevention or treatment of diseases associated with the activation of STAT3 protein.

Abstract: A heterocyclic derivative represented by formula (I), or a pharmaceutically acceptable salt or a stereoisomer thereof, which has an inhibitory effect on the activation of STAT3 protein, and is useful for the prevention or treatment of diseases associated with the activation of STAT3 protein.

Abstract: The subject invention relates to insecticidal toxin complex (“TC”) fusion proteins and to polynucleotides that encode these fusion proteins. In some embodiments, the invention provides a fusion protein comprising a Class A protein, a Class B protein, and a Class C TC protein fused together to form a single protein. In some other embodiments, the invention provides a fusion protein comprising a Class B and a Class C TC proteins fused together. In the latter embodiments, the BC or CB fusion protein can be used to enhance or potentiate the anti-insect activity of a “Toxin A” or Class A protein. The subject invention also includes plants, cells (bacterial and plant cells for example), and seeds that comprise the polynucleotides. The subject invention also includes methods of controlling pests (preferably insects and other plant pests) with fusion proteins of the subject invention.

Abstract: Disclosed herein is a no-welding type battery pack using one or more forced-inserting type rivets. A cap assembly includes a base plate mounted to an open upper end of a battery case, a protection circuit module (PCM) mounted on the base plate, and a top cap coupled to the upper end of the battery case while the top cap covers the PCM. The top cap is made of an insulative material. The electrical connection and the mechanical coupling between the PCM and the base plate are accomplished by one or more forced-inserting type rivets. The cap assembly is included the battery pack. The no-welding type battery pack using the one or more forced-inserting type rivets is manufactured without welding or soldering requiring an excessive amount of time and skilled technique during the electrical connection between the battery cell and the PCM. As a result, the assembly process of the battery pack is simplified, and therefore, the manufacturing time of the battery pack is reduced.

Abstract: The subject invention relates to insecticidal toxin complex (“TC”) fusion proteins and to polynucleotides that encode these fusion proteins. In some embodiments, the invention provides a fusion protein comprising a Class A protein, a Class B protein, and a Class C TC protein fused together to form a single protein. In some other embodiments, the invention provides a fusion protein comprising a Class B and a Class C TC proteins fused together. In the latter embodiments, the BC or CB fusion protein can be used to enhance or potentiate the anti-insect activity of a “Toxin A” or Class A protein. The subject invention also includes plants, cells (bacterial and plant cells for example), and seeds that comprise the polynucleotides. The subject invention also includes methods of controlling pests (preferably insects and other plant pests) with fusion proteins of the subject invention.

Abstract: The subject invention relates to insecticidal toxin complex (“TC”) fusion proteins and to polynucleotides that encode these fusion proteins. In some embodiments, the invention provide a fusion protein comprising a Class A protein, a Class B protein, and a Class C TC protein fused together to form a single protein. In some other embodiments, the invention provides a fusion protein compromising a Class B and a Class C TC proteins fused together. In the latter embodiments, the BC and CB fusion protein can be used to enhance or potentate the anti-insect activity of a “Toxin A” or Class A protein. The subject invention also includes plants, cells (bacterial and plant cells for example) and seeds that comprise the polynueleotides. The subject invention also includes methods of controlling pests (preferably insects and other plant pests) with fusion proteins of the subject invention.

Abstract: Disclosed herein is a no-welding type battery pack using one or more forced-inserting type rivets. A cap assembly includes a base plate mounted to an open upper end of a battery case, a protection circuit module (PCM) mounted on the base plate, and a top cap coupled to the upper end of the battery case while the top cap covers the PCM. The top cap is made of an insulative material. The electrical connection and the mechanical coupling between the PCM and the base plate are accomplished by one or more forced-inserting type rivets. The cap assembly is included the battery pack. The no-welding type battery pack using the one or more forced-inserting type rivets is manufactured without welding or soldering requiring an excessive amount of time and skilled technique during the electrical connection between the battery cell and the PCM. As a result, the assembly process of the battery pack is simplified, and therefore, the manufacturing time of the battery pack is reduced.