Abstract: A system comprising a first electroacoustic transducer connected to an interrogation unit and at least one second electroacoustic transducer connected to a resonator, wherein the first electroacoustic transducer and the second electroacoustic transducer form an acoustic channel and the second electroacoustic transducer forms with the resonator a passive cooperative target which, upon receiving an interrogation signal from the interrogation unit, transmits a response signal via the acoustic channel, and the interrogation signal has a higher energy than the response signal.

Abstract: A system comprising a first electroacoustic transducer connected to an interrogation unit and at least one second electroacoustic transducer connected to a resonator, wherein the first electroacoustic transducer and the second electroacoustic transducer form an acoustic channel and the second electroacoustic transducer forms with the resonator a passive cooperative target which, upon receiving an interrogation signal from the interrogation unit, transmits a response signal via the acoustic channel, and the interrogation signal has a higher energy than the response signal.

Abstract: The invention describes a method for producing chip cards with contactless and/or contact-type operation having a multilayer card body, an integrated circuit and at least one coil (2, 21) for data exchange and for power supply. The coil (2, 21) is applied to one or more layers (11) of the card body by printing technology, whereby after production of the printed coil a metal foil (4, 41) is placed over the coil terminals (32, 33) and laminated into the card body, thereby producing the connection between the contact areas (32, 33) of the printed coil and the metal foil (4, 41).

Abstract: A method for producing a multilayer data carrier (1) having a surface structure (2) embossed at least in certain areas on one side. In the method, a first multilayer semifinished product (3) is first produced into which the surface structure (2) is embossed. The semifinished product (3) is then connected with a second multilayer semifinished product (4) or a further layer (17) with interposition of an adhesive layer (5). Furthermore, a corresponding manufacturing plant is described.

Abstract: For throughplating flexible circuit boards, two electrically conductive layers located on opposing surfaces are electrically interconnected by cutting through the circuit board using a simple cutting tool for producing a passage. A defined quantity of conductive material is then inserted optionally into the through hole.

Abstract: A method for producing a multilayer data carrier (1) having a surface structure (2) embossed at least in certain areas on one side. In the method, a first multilayer semifinished product (3) is first produced into which the surface structure (2) is embossed. The semifinished product (3) is then connected with a second multilayer semifinished product (4) or a further layer (17) with interposition of an adhesive layer (5). Furthermore, a corresponding manufacturing plant is described.

Abstract: The invention describes a method for producing chip cards with contactless and/or contact-type operation having a multilayer card body, an integrated circuit and at least one coil (2, 21) for data exchange and for power supply. The coil (2, 21) is applied to one or more layers (11) of the card body by printing technology, whereby after production of the printed coil a metal foil (4, 41) is placed over the coil terminals (32, 33) and laminated into the card body, thereby producing the connection between the contact areas (32, 33) of the printed coil and the metal foil (4, 41).

Abstract: For throughplating flexible circuit boards, two electrically conductive layers located on opposing surfaces are electrically interconnected by cutting through the circuit board using a simple cutting tool for producing a passage. A defined quantity of conductive material is then inserted optionally into the through hole.

Abstract: The invention relates to different methods for distortion-free production of data carriers having at least in partial areas a transparent plastic layer with a surface structure in the form of a lens structure. The surface structure can be produced by cutting method or embossed by applying heat and pressure. Alternatively the surface structure can be produced as a separate element which is connected after its production with the data carrier.

Abstract: The invention relates to a method for producing injection-molded cards with at least one decorative layer (2, 6) which is already applied to a foil (1, 7) or an inlay before injection molding. To protect the inks used for the decoration from thermal action and/or excessive pressures and/or high mechanical stress during injection molding, the decorative layer (2, 6) is covered according to the invention with a protective layer (3, 5) before the foil (1, 7) provided with the decoration or an inlay provided with a decoration is inserted into the injection mold.

Abstract: The invention relates to different methods for distortion-free production of data carriers having at least in partial areas a transparent plastic layer with a surface structure in the form of a lens structure. The surface structure can be produced by cutting methods or embossed by applying heat and pressure. Alternatively the surface structure can be produced as a separate element which is connected after its production with the data carrier.

Abstract: The card body of a data carrier with elements disposed therein, for example an electronic module, is produced from a pressed molding compound in a pressing apparatus. The elements to be embedded in the card body are preferably incorporated in the pressing apparatus and positioned and fixed there before the pressing operation.

Abstract: A semifinished product for an electronic module includes an integrated circuit and a coil electrically connected with the circuit, the coil being disposed between two carrier layers and the integrated circuit being disposed in a specially provided cavity in the two carrier layers. To achieve plane surfaces of the semifinished product, the remaining cavity between the carrier layers and the integrated circuit is filled with a filling material in such a way that plane surfaces of the semifinished product result in the area of the cavity which are flush with the surfaces of the carrier layers.

Abstract: A data carrier in which an electronic module comprising an integrated circuit and a coil electrically connected with the circuit is disposed in a channel in the data carrier. To permit simple manufacture of the data carrier, at least one opening for forming the channel is provided in at least one card layer, the opening being formed such that the layer is a cohesive layer.

Abstract: A method for making integrated circuits electrically connected to conductive coil elements includes placing integrated circuits in recesses provided at precise locations along a foil carrier web and positioning coils also at designated locations on the foil web so that a coil is associated with each integrated circuit. The web is then cut to produce a planar coil electrically connected to an integrated circuit on a foil element. The integrated circuit and coils may be coated with a casting compound and the coils may be formed using various procedures, including pressing coils into the surface of the foil, sewing the coils to the foil and electrostatically forming the coils on the foil with fusion of the coil material directly onto the foil. Apparatus for carrying out the aforesaid process, including winding of the coils, is described.

Abstract: An electronic module to be installed in a data carrier is described, the electronic module having an integrated circuit disposed on a carrier of the module and connected electrically with a coil for noncontacting data exchange. To make such electronic modules easy to produce and more cost-effective, the inventive module dispenses completely with an additional separate substrate for receiving the integrated circuit and coil.

Abstract: The card body of a data carrier with elements disposed therein, for example an electronic module, is produced from a pressed molding compound in a pressing apparatus. The elements to be embedded in the card body are preferably incorporated in the pressing apparatus and positioned and fixed there before the pressing operation.

Abstract: The invention relates to a method for producing data carriers containing a positioned element on at least one of their surfaces from a multiple-copy sheet. As many method steps as possible are performed on the multiple-copy sheet which is subdivided, before the elements are positioned in the data carriers, into smaller units having positioning markings as position references. Using these markings the small units are brought in an exact position relative to various working stations, where several data carriers in the units are provided with a positioned element simultaneously.

Abstract: An apparatus for singling cards, such as check cards, identity cards and the like, which consists of a magazine for storing the cards in a stack, a removing device and a retaining device. The cards are disposed in the magazine rotated at a defined angle from one another, resulting in protruding surfaces between two successive cards. For singling, the uppermost card is lifted off in an axis perpendicular to the card surface by means of a removing device. The card following the uppermost card is held back in the magazine by means of a retaining device, the retaining device acting on the protruding surface of the following card.

Abstract: A method for producing identity cards which uses card bodies with standardized outer dimensions and wherein carrier elements with different dimensions are incorporated in the card bodies, the carrier elements having at least one integrated circuit connected electroconductively with coupling elements used for communication of the integrated circuit with external devices, characterized in thatadapter elements formed with uniform outer dimensions are provided for receiving the different carrier elements,for receiving the adapter elements the card bodies are provided with recesses corresponding in shape and size substantially to the outer dimensions of the adapter elements, andthe carrier elements are connected with the card body via the adapter elements.