Abstract: Consistent with an embodiment of the present invention, there is a device for transferring a substantially disc-shaped workpiece from a workpiece carrier. The workpiece is fastened along a first one of its main surfaces with a double-side adhesive foil onto a carrier foil. The workpiece is fastened onto the carrier foil along a first one of the its main surfaces with a double-sided adhesive foil onto a carrier foil on whose surface the workpiece is to be provided and fastened along the first main surface in an at least substantially planar manner. The first double-sided adhesive foil is adhesively connected by a first adhesive layer provided on its first surface to a first surface of the workpiece carrier and by a second adhesive layer provided on it second surface to the workpiece alone the first main surface thereof.

Abstract: A method is described for transferring a disc-shaped workpiece from a workpiece carrier, on which the workpiece is fastened along its first main surface by means of a first double-sided adhesive foil, onto a carrier foil, wherein the first double-sided adhesive foil is connected by a first adhesive layer to the workpiece carrier and by a second adhesive layer to the workpiece, with the following process steps: weakening the second adhesive layer through decomposition of its adhesive material down to a reduced adhesive force which is substantially smaller than the adhesive force of the first adhesive layer, fastening the workpiece carrier to a first retaining device, fastening the workpiece with its second main surface to a second retaining device by means of a second double-sided adhesive foil, such that the second double-sided adhesive foil is connected by a third adhesive layer to the second retaining device and by a fourth adhesive layer to the workpiece, and the adhesive forces of the third and the fourth

Abstract: Consistent with an embodiment of the present invention, there is a device for transferring a substantially disc-shaped workpiece from a workpiece carier. The workpiece is fastened along a first one of its main surfaces with a double-sided adhesive foil onto a carrier foil. The workpiece is fastened onto the carrier foil along a first one of its main surfaces with of a double-sided adhesive foil onto a carrier foil on whose surface the workpiece is to be provided and fastened along the first main surface in an at least substantially planar manner. The first double-sided adhesive foil is adhesively connected by a first adhesive layer provided on its first surface to a first surface of the workpiece carrier and by a second adhesive layer provided on its second surface to the workpiece along the first main surface thereof.

Abstract: A technique for transferring a workpiece with one surface connected to a first workpiece carrier by a first adhesive onto a second workpiece carrier. This technique includes: fastening the second carrier to another surface of the workpiece with a second adhesive that has an adhesive force greater than the first adhesive, fastening the first earner to a first retaining device, fastening the second carrier to a second retaining device, separating the workpiece from the first carrier by a pulling force between the first and second retaining devices, separating the first carrier from the first retaining device, and separating the second carrier with the workpiece connected thereto from the second retaining device.

Abstract: A method is described for transferring a disc-shaped workpiece from a workpiece carrier, on which the workpiece is fastened along its first main surface by means of a first double-sided adhesive foil, onto a carrier foil, wherein the first double-sided adhesive foil is connected by a first adhesive layer to the workpiece carrier and by a second adhesive layer to the workpiece, with the following process steps:

Abstract: A method is described for the transfer of a substantially disc-shaped workpiece from a first workpiece carrier, on which the workpiece is adhesively connected along a first of its main surfaces by means of a first adhesive in an at least substantially planar manner, onto a second workpiece carrier, which method according to the invention comprises the following process steps:

Abstract: A method of processing a substantially wafer-shaped product in semiconductor technology is described, which product is designed for the formation of a number of electronic circuit bodies over at least a first of its main surfaces, which circuit bodies are to be mechanically separated substantially perpendicularly to the first main surface, and which product has a second main surface lying opposite the first main surface.