Patents by Inventor Joachim Aurich

Joachim Aurich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9984190
    Abstract: Systems and methods are provided for determining parameters of a power MOSFET model. First data related to characteristics of a semiconductor device in a steady-state operation and second data related to transient-response characteristics of the device are received. Variables of one or more functions are fit to the first data to determine static parameters of a power MOSFET model. A computer simulation is executed to determine transient-response characteristics of the model as configured with a current set of dynamic parameters, where the simulation generates a set of values indicative of the model's transient-response characteristics. An error value indicating a difference between the set of values and the second data is determined. Based on a determination that the error value is greater than the threshold, values of the current set of dynamic parameters are adjusted based on the error value and results of computer simulations.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: May 29, 2018
    Assignee: Ansys, Inc.
    Inventors: Joachim Aurich, Shimeng Huang, Sameer Kher, Torsten Fichtner
  • Patent number: 9899171
    Abstract: In order to provide a method for isolating a circuit and a thermal link, wherein the link has a very low resistance and is suitable for high currents, in particular very high short load currents, and also has a high degree of reliability, in particular under difficult conditions, such as thermal and mechanical loading which lasts for a relatively long time, for example, the invention proposes that, during the phase transition of the material of the fusible element (10) from the solid to the liquid state, the volume of the fusible element (10) increases and the pressure increases and, owing to the increase in volume and the increase in pressure, the fusible element (10) is dislodged so as to break the electrical connection.
    Type: Grant
    Filed: July 26, 2011
    Date of Patent: February 20, 2018
    Assignee: VISHAY BCcomponents BEYSCHLAG GmbH
    Inventors: Joachim Aurich, Ulf Zum Felde, Bernd Krueger, Laurent Mex, Wolfgang Werner
  • Patent number: 9110002
    Abstract: A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: August 18, 2015
    Assignee: VISHAY BCCOMPONENTS BEYSCHLAG GMBH
    Inventors: Wolfgang Werner, Joachim Aurich, Sascha Werth
  • Publication number: 20130234822
    Abstract: In order to provide a method for isolating a circuit and a thermal link, wherein the link has a very low resistance and is suitable for high currents, in particular very high short load currents, and also has a high degree of reliability, in particular under difficult conditions, such as thermal and mechanical loading which lasts for a relatively long time, for example, the invention proposes that, during the phase transition of the material of the fusible element (10) from the solid to the liquid state, the volume of the fusible element (10) increases and the pressure increases and, owing to the increase in volume and the increase in pressure, the fusible element (10) is dislodged so as to break the electrical connection.
    Type: Application
    Filed: July 26, 2011
    Publication date: September 12, 2013
    Inventors: Joachim Aurich, Ulf Zum Felde, Bernd Krueger, Laurent Mex, Wolfgang Werner
  • Publication number: 20130039380
    Abstract: A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.
    Type: Application
    Filed: July 16, 2012
    Publication date: February 14, 2013
    Applicant: Vishay BCcomponents Beyschlag GmbH
    Inventors: Wolfgang Werner, Joachim Aurich, Sascha Werth
  • Patent number: 8220988
    Abstract: A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.
    Type: Grant
    Filed: November 2, 2007
    Date of Patent: July 17, 2012
    Assignee: Vishay BCcomponents Beyschlag GmbH
    Inventors: Wolfgang Werner, Joachim Aurich, Sascha Werth
  • Patent number: 7720265
    Abstract: The invention relates to a fingerprint recognition module comprising a substrate consisting of a material that is electrically insulating at least on its upper side and at least partially thermally insulating. Said substrate receives a composite of structured thin films on its surface, which directly forms a measuring field on the surface of the substrate for measuring a fingerprint. Said composite consists of an array of resistive, temperature-dependent elements, and contains strip conductors which connect the resistive, temperature-dependent elements to at least one connection field located on the substrate, outside the measuring field, and form part of the composite of structured thin films.
    Type: Grant
    Filed: May 15, 2003
    Date of Patent: May 18, 2010
    Assignee: Inabillion AS
    Inventors: Burkhard Büstgens, Gerald Urban, Joachim Aurich, Günter Igel
  • Publication number: 20100054299
    Abstract: A sensor device is provided for detecting thawing on surfaces with interdigital electrodes formed in a resistance layer which is formed on a substrate. In order to develop the sensor device further so that the measuring speed of the sensor device is further increased, the disclosure proposes that the interdigital electrodes and recesses between the interdigital electrodes have a moisture-sensitive hydrophilic surface through condensation cores applied to it.
    Type: Application
    Filed: November 2, 2007
    Publication date: March 4, 2010
    Applicant: VISHAY BCCOMPONENTS BEYSCHLAG GMBH
    Inventors: Wolfgang Werner, Joachim Aurich, Sascha Werth
  • Publication number: 20060050935
    Abstract: The invention relates to a fingerprint recognition module comprising a substrate consisting of a material that is electrically insulating at least on its upper side and at least partially thermally insulating. Said substrate receives a composite of structured thin films on its surface, which directly forms a measuring field on the surface of the substrate for measuring a fingerprint. Said composite consists of an array of resistive, temperature-dependent elements, and contains strip conductors which connect the resistive, temperature-dependent elements to at least one connection field located on the substrate, outside the measuring field, and form part of the composite of structured thin films.
    Type: Application
    Filed: May 15, 2003
    Publication date: March 9, 2006
    Inventors: Burkhard Bustgens, Gerald Urban, Joachim Aurich, Gunter Igel