Abstract: A micromechanical component for a sensor or microphone device, including a substrate, a frame structure, which is situated on the substrate surface and/or at least one intermediate layer, and a diaphragm, which spans an inner volume, which is at least partially framed by the frame structure. The micromechanical component includes a bending beam structure, which is situated in the inner volume and includes at least one anchoring area, which is attached to the frame structure, to the substrate surface and/or to the at least one intermediate layer, and at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by way of a warping of the diaphragm.

Abstract: A production method for a micromechanical component for a sensor or microphone device. The method includes: patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate made of at least one semiconductor material using anisotropic etching, covering the lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer, etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches, and by covering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of the at least one identical semiconductor material as the monocrystalline substrate.

Abstract: A micromechanical component. The micromechanical component includes: a membrane; the membrane includes at least one reinforcement structure of a geometrically defined shape, which reinforces the membrane in a defined manner, in the region of at least one anchor structure and/or in the region of at least one connecting structure.

Abstract: A production method for a micromechanical component for a sensor or microphone device. The method includes: patterning a plurality of first trenches through a substrate surface of a monocrystalline substrate made of at least one semiconductor material using anisotropic etching, covering the lateral walls of the plurality of first trenches with a passivation layer, while bottom areas of the plurality of first trenches are kept free or are freed of the passivation layer, etching at least one first cavity, into which the plurality of first trenches opens, into the monocrystalline substrate using an isotropic etching method, in which an etching medium of the isotropic etching method is conducted through the plurality of first trenches, and by covering the plurality of first trenches by epitaxially growing a monocrystalline sealing layer on the substrate surface of the monocrystalline substrate made of the at least one identical semiconductor material as the monocrystalline substrate.

Abstract: A method for manufacturing a MEMS unit for a micromechanical pressure sensor. The method includes the steps: providing a MEMS wafer including a silicon substrate and a first cavity formed therein, under a sensor membrane; applying a layered protective element on the MEMS water; and exposing a sensor core from the back side, a second cavity being formed between the sensor core and the surface of the silicon substrate, and the second cavity being formed with the aid of an etching process which is carried out with the aid of etching parameters changed in a defined manner; and removing the layered protective element.

Abstract: A micromechanical component for a sensor or microphone device, including a substrate, a frame structure, which is situated on the substrate surface and/or at least one intermediate layer, and a diaphragm, which spans an inner volume, which is at least partially framed by the frame structure. The micromechanical component includes a bending beam structure, which is situated in the inner volume and includes at least one anchoring area, which is attached to the frame structure, to the substrate surface and/or to the at least one intermediate layer, and at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by way of a warping of the diaphragm.

Abstract: A method for producing a micromechanical pressure sensor. The method includes: providing a MEMS wafer having a silicon substrate and a first cavity developed therein underneath a sensor diaphragm; providing a second wafer; bonding the MEMS wafer to the second wafer; and exposing a sensor core from the rear side; a second cavity being formed in the process between the sensor core and the surface of the silicon substrate, and the second cavity being developed with the aid of an etching process which is carried out using etching parameters that are modified in a defined manner.

Abstract: A method for manufacturing a MEMS unit for a micromechanical pressure sensor. The method includes the steps: providing a MEMS wafer including a silicon substrate and a first cavity formed therein, under a sensor membrane; applying a layered protective element on the MEMS water; and exposing a sensor core from the back side, a second cavity being formed between the sensor core and the surface of the silicon substrate, and the second cavity being formed with the aid of an etching process which is carried out with the aid of etching parameters changed in a defined manner; and removing the layered protective element.

Abstract: A method for producing a micromechanical pressure sensor. The method includes: providing a MEMS wafer having a silicon substrate and a first cavity developed therein underneath a sensor diaphragm; providing a second wafer; bonding the MEMS wafer to the second wafer; and exposing a sensor core from the rear side; a second cavity being formed in the process between the sensor core and the surface of the silicon substrate, and the second cavity being developed with the aid of an etching process which is carried out using etching parameters that are modified in a defined manner.

Abstract: The invention relates to an applicator instrument for applying dental compounds. The applicator instrument comprises an instrument head with a support structure and with a plurality of projections formed on the support structure. The projections are elastic and, in relation to a height extent, have less stiffness than the support structure. Between them, the projections enclose a receiving space for the dental compound. According to the invention, the projections have a planar configuration and, in relation to a width extent, are arranged substantially parallel to one another. The greatest diameter of the instrument head is between 2 mm and 3 mm. With the applicator instrument according to the invention, it is easier to apply the dental compound in dosed amounts and to spread the dental compound across the surface that is to be treated.

Abstract: A dispensing system comprising a discharge tool in the form of a compule gun and a replaceable dispensing container in the form of a compule for dental compound. The dispensing container comprises a housing, on the inside of which a slide surface is formed that is intended for engagement with a plunger. The housing encloses an interior and is provided with an outlet channel. A portion of a needle is inserted into the outlet channel. A gap is present between the circumference of the needle and the outlet channel. An adhesive is introduced into the gap. A ram in the discharge tool engages the plunger. A method also produces a dispensing system of this kind.

Abstract: A cascaded micromechanical actuator structure for rotating a micromechanical component about a rotation axis is described. The structure includes a torsion spring device which, on the one hand, is attached to a mount and to which, on the other hand, the micromechanical component is attachable. The torsion spring device has a plurality of torsion springs which run along or parallel to the rotation axis. The structure includes a rotary drive device having a plurality of rotary drives which are connected to the torsion spring device in such a way that each rotary drive contributes a fraction to an overall rotation angle of a micromechanical component about the rotation axis.

Abstract: A micromechanical component has a light window; a mirror element adjustable with respect to the light window from a first position into at least one second position about at least one axis of rotation, an optical sensor having a detection surface designed to ascertain a light intensity on the detection surface and to provide a corresponding sensor signal. The light window, the mirror element in the first position and the detection surface are situated in relation to one another in such a way that a portion of a light beam reflected on the light window strikes the detection surface at least partially; and an evaluation unit designed to define, on the basis of the sensor signal, information regarding an instantaneous position of the mirror element and/or an instantaneous intensity of the deflected light beam.

Abstract: In a micromechanical component having an inclined structure and a corresponding manufacturing method, the component includes a substrate having a surface; a first anchor, which is provided on the surface of the substrate and which extends away from the substrate; and at least one cantilever, which is provided on a lateral surface of the anchor, and which points at an inclination away from the anchor.

Abstract: The invention relates to a dispensing container for a dental compound. The dispensing container comprises a chamber (15), a discharge tip (16) and a channel (17), which extends from the chamber (15) as far as a channel opening (18) arranged at the front end of the discharge tip (16). The discharge tip (16) has a jacket surface (23) tapering towards the front end. A cap (20) is provided which has an inner surface adapted to the jacket surface (23) of the discharge tip (16). According to the invention, the inner surface of the cap (20) has a plurality of guide webs (24). The invention also relates to a cap for a dispensing container of this kind. The dispensing container according to the invention reduces the likelihood of the dental compound being contaminated by particles.

Abstract: A composite capsule for receiving and dispensing a dental compound. The composite capsule has a receiving space, which is surrounded by a capsule wall and which extends between a discharge opening and a receiving opening, wherein the discharge opening is arranged at a front end of the receiving space, and the receiving opening is arranged at a rear end of the receiving space. The composite capsule comprises a support face, which protrudes outward in relation to the capsule wall and which is oriented in the direction of the front end. The support face is interrupted by a thread recess. By way of the thread recess, the composite capsule can be connected to a storage container, in order to introduce a desired amount of dental compound into the composite capsule.

Abstract: A method for operating an electrostatic drive having a stator electrode and an actuator electrode which are designed as multilayer electrodes having subunits includes: predeflecting the actuator electrode with respect to the stator electrode from its non-energized starting position into a first end position by applying a first potential to the first stator electrode subunit, and applying a second potential which is different from the first potential to the first actuator electrode subunit, and applying a third potential which is different from the first potential and the second potential, to the second stator electrode subunit and to the second actuator electrode subunit.

Abstract: An applicator instrument for applying dental compounds includes an instrument head. The instrument head has a support structure with a plurality of elastic projections formed on the support structure. The projections have less stiffness than the support structure with respect to a height extent and enclose a receiving space for the dental compound. Additionally, the projections have a planar configuration and are arranged substantially parallel to one another with respect to a width extent. The diameter of the instrument head is equal to or less than 3 mm. Using this applicator instrument, it is easier to apply dental compound in dosed amounts and to spread the dental compound across a surface to be treated.

Abstract: An electrode comb for a micromechanical component includes at least one electrode finger for which a first electrode finger subunit with a first central longitudinal axis and a second electrode finger subunit with a second central longitudinal axis are defined. The second central longitudinal axis are defined is inclined in relation to the first central longitudinal axis about a bend angle not equal to 0° and not equal to 180°.