Abstract: A mechanism is provided for resolving uplift or coupling timing problems and slew violations without sacrificing late mode timing in integrated circuit (IC) designs. Responsive to a request being received to generate a new IC design, for each net in a plurality of nets in the new IC design, a determination is made as to whether the net is routable through a cell in a plurality of cells using a cost function associated with the cell such that a coupling capacitance associated with the net is equal to or below a predetermined coupling capacitance threshold. Responsive to net being able to be routed through the cell with the coupling capacitance being equal to or below the threshold, the net is assigned to at least one track within the cell. Responsive to all nets in the new IC design being routed, a new IC design is generated.

Abstract: An apparatus, system and method of automatically computing power consumption estimation of a chip are provided. The apparatus, system and method include determining all circuit blocks or macros embedded in the chip and retrieving from a file, into which pre-generated power consumption values of the macros are stored, the power consumption value of each macro. After doing so, the power consumption value of the chip is automatically computed. The apparatus, system and method also compute a desired power consumption estimation of the chip as well as a plurality of power densities. A desired power consumption estimation is based on a desired voltage and a desired frequency while a power density is power used in a certain area. Further, the apparatus, system and method reproduces the floorplan of the chip and represents each area within the chip by a different color to illustrate hot spots and cool spots.

Abstract: An apparatus, system and method of automatically computing power consumption estimation of a chip are provided. The apparatus, system and method include determining all circuit blocks or macros embedded in the chip and retrieving from a file, into which pre-generated power consumption values of the macros are stored, the power consumption value of each macro. After doing so, the power consumption value of the chip is automatically computed. The apparatus, system and method also compute a desired power consumption estimation of the chip as well as a plurality of power densities. A desired power consumption estimation is based on a desired voltage and a desired frequency while a power density is power used in a certain area. Further, the apparatus, system and method reproduces the floorplan of the chip and represents each area within the chip by a different color to illustrate hot spots and cool spots.

Abstract: An integrated scanning force microprobe and optical microscopy metrology system is disclosed, that measures the depth and width of a trench in a sample. The probe remains fixed while the sample is moved relative to the probe. The system detects the proximity of the probe to a sample and to the side walls of the trench, providing output signals indicating the vertical and transverse relationship of the probe to the sample. The system adjusts the relative position of the sample vertically and transversely as a function of the output signals. Variety of probes can be used with this system to detect the depth and width of the trench. The probe should have at least one protuberance extending down to sense the bottom of the trench. The tip of the probe can have Lateral protuberances that can extend in opposite directions (across the width of the trench) from the probe to detect the side walls of the trench.

Abstract: Methods are described for producing a needle probe tip having prescribed magnetic properties for a scanning magnetic force microscope (MFM) on a substrate positioned in an evacuated environment. A substantially rigid, nanometer-scale needle-like structure is produced by selective decomposition of a volatile organic compound by a highly focussed electron beam. Processing steps are described to obtain prescribed magnetic properties of such a needle probe structure; in particular, the fabrication of a single magnetic domain, with hard or soft magnetic properties at the distal end of the needle structure. Three dimensional probe tips are also achieved. These magnetic sensing probes allow magnetic imaging at the nanometer-scale level.

Abstract: A technique is described for improving metal-organic substrate adhesion and for reducing stress between the metal film and the substrate. Low energy reactive ions, electrons, or photons are incident upon the substrate to alter the surface chemistry of the substrate to a depth of from about 10 angstroms to a few hundred angstroms. The energy of the incident reactive ions and electrons is about 50-2000 eV, while the energy of the incident photons is about 0.2-500 eV. Irradiation of the substrate can occur prior to or during metal deposition. For simultaneous metal deposition/particle irradiation, the arrival rates of the metal atoms and the substrate treatment particles are within a few order of magnitude of one another. Room temperatures or elevated temperatures are suitable.